Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
AR05FTC2002是光颉(Viking)针对小型化高精度电路推出的0805封装薄膜贴片电阻,核心聚焦“小体积下的宽温稳定性与精准度”,可覆盖消费电子、工业控制等多领域的常规及 harsh环境应用。其核心特征可总结为:20kΩ标准阻值、±1%高精度、±25ppm/℃低温度系数、100mW额定功率、-55℃~+155℃宽工作温度,是一款兼顾密度与性能的基础被动元件。
阻值与精度
固定20kΩ属于电子电路中常用的标准值(适配分压、电流采样等常规场景),±1%的精度满足绝大多数工业级、消费级电路的信号调理需求——无需额外校准即可保证电路性能一致性,避免因阻值偏差导致的信号失真。
功率与电压能力
100mW额定功率适配低功耗电路(如微控制器周边、传感器信号链);100V的工作电压突破了常规0805电阻的限制(多数产品仅支持25V/50V),可用于中等电压的模拟电路(如电源监测、线性稳压反馈),扩展了应用边界。
温度特性
±25ppm/℃的温度系数是薄膜电阻的核心优势:当环境温度变化100℃时,阻值漂移仅0.25%,远优于碳膜电阻(典型±500ppm/℃),能有效避免宽温环境下电路参数偏移(如工业户外设备、车载低温启动场景)。
工作温度范围
-55℃~+155℃覆盖了工业级环境的极端温度,无需额外降额使用即可保证长期可靠性,适配户外设备、车载低压电路等场景。
AR05FTC2002以“小封装+高精度+宽温适配”为核心,是光颉针对中端电子电路推出的高性价比薄膜电阻,可满足多数场景下的基础被动元件需求。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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