WMSIC Electronic Components

Viking ARG03BTC1581

ModelARG03BTC1581
Package0603
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG03BTC1581
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG03BTC1581
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.023g
Electronic Component
1.58kΩ
Electronic Component
1
Electronic Component
BM0265636746
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ARG03BTC1581 薄膜贴片电阻产品概述

一、产品核心定位与典型应用场景

ARG03BTC1581是Viking(光颉)推出的高精度小功率薄膜贴片电阻,聚焦对阻值精度、温度稳定性要求严苛的精密电子系统,是替代传统低精度电阻、提升电路性能的核心元件。其典型应用场景包括:

  • 工业自动化:传感器信号调理电路(如压力、温度传感器电桥匹配),稳定阻值保证测量精度;
  • 通信设备:射频模块阻抗匹配网络,低温度系数减少频率漂移;
  • 医疗仪器:监护仪、心电图机生物电信号放大回路,±0.1%精度避免信号失真;
  • 汽车电子:车载传感器电路(胎压监测、水温检测),宽温范围适配发动机舱高温环境。

二、关键技术参数及性能优势

ARG03BTC1581的核心参数围绕“高精度、高稳定、小体积”设计,具体性能如下:

  • 阻值与精度:标称阻值1.58kΩ(编码1581,即158×10¹Ω),精度达±0.1%——远高于普通厚膜电阻的±1%/±0.5%,可直接用于精密阻抗匹配,无需额外校准;
  • 功率与电压:额定功率100mW,额定工作电压75V,适配低功耗电路(如电池供电设备),同时满足中低压信号传输需求;实际使用需同时满足:(V=IR≤75V) 且 (P=I²R≤100mW);
  • 温度稳定性:温度系数(TCR)±25ppm/℃——温度每变化1℃,阻值变化仅±25×10⁻⁶倍标称值。以25℃为基准,125℃时阻值变化约2.96Ω,相对变化率0.187%,远低于行业平均水平;
  • 宽温工作范围:-55℃+155℃,覆盖工业级(-40+85℃)、汽车级(-40~+125℃)及高温作业场景,极端环境下电路性能稳定。

三、封装与制造工艺特性

ARG03BTC1581采用0603封装(英制:0.06″×0.03″,公制:1.6mm×0.8mm),是小型化电路的理想选择,可大幅提升PCB布局密度;其核心工艺为薄膜电阻技术:

  • 薄膜层通过真空溅射沉积在陶瓷基底上,厚度仅纳米级,成分均匀性远优于厚膜电阻(厚膜为丝网印刷烧结,厚度微米级);
  • 薄膜工艺赋予其低噪声(典型值< -40dB)、高频特性优异(截止频率达GHz级),适合射频、高速信号电路;
  • 陶瓷基底低膨胀系数,与薄膜层匹配性好,进一步降低温度漂移。

四、可靠性与环境适应性

ARG03BTC1581经过严格可靠性测试,满足工业级应用需求:

  • 环境测试:通过温度循环(-55~155℃,1000次)、湿热老化(85℃/85%RH,1000小时),阻值变化率<0.1%;
  • 焊接可靠性:兼容回流焊、波峰焊工艺,焊接后无虚焊、脱落,符合IPC-A-610标准;
  • 环保合规:采用无铅工艺,符合RoHS 2.0、REACH等全球环保法规,可用于出口产品。

五、品牌与品质保障

Viking(光颉)是全球知名被动元件制造商,专注电阻研发20余年,ARG系列是其高精度薄膜电阻核心产品线,产品广泛应用于华为、中兴、西门子等企业高端设备。ARG03BTC1581出厂前100%全检,精度、阻值、TCR等参数均符合设计要求,为客户提供稳定可靠的元件支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.