WMSIC Electronic Components

Viking ARG05FTC6042

ModelARG05FTC6042
Package0805
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG05FTC6042
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG05FTC6042
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.029g
Electronic Component
60.4kΩ
Electronic Component
1
Electronic Component
BM0265636675
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ARG05FTC6042 薄膜贴片电阻产品概述

ARG05FTC6042是Viking(光颉)电子推出的高精密薄膜贴片电阻,针对高密度贴装、宽温环境及低噪声需求设计,适配工业控制、通信、消费电子等多领域应用,其核心参数与可靠性表现符合高端电子系统的性能要求。

一、产品基本定位

该电阻属于光颉ARG系列薄膜电阻,采用0805(英制)小封装设计,主打小功率、高精度、宽温稳定特性,解决传统碳膜电阻精度不足、温漂大的问题,尤其适合对阻值一致性、环境适应性要求较高的电路场景。

二、核心性能参数

ARG05FTC6042的关键参数可满足多数精密电路需求:

  • 阻值与精度:固定阻值60.4kΩ,精度±1%,采用激光调阻工艺确保阻值一致性;
  • 功率与电压:额定功率125mW,最大工作电压150V,实际应用需遵循降额原则(建议功率不超额定70%、电压不超额定80%);
  • 温度特性:温度系数(TCR)±25ppm/℃,阻值随温度变化极小,在宽温范围内保持稳定;
  • 工作温度范围:-55℃~+155℃,覆盖工业级极端环境(如户外设备、高温车间)。

三、封装与工艺规格

  • 封装尺寸:0805英制封装(公制对应2.0mm×1.2mm),引脚焊盘尺寸符合IPC标准,适配回流焊、波峰焊等常规贴片工艺;
  • 工艺特点:采用金属薄膜沉积技术(常见镍铬或钌基薄膜),相比碳膜电阻噪声更低、长期稳定性更好,激光调阻确保精度达标后无额外阻值漂移;
  • 外形结构:矩形贴片式,表面印有阻值代码(6042对应60.4kΩ,“604”为有效数字,“2”为倍率10²),便于批量识别。

四、典型应用场景

ARG05FTC6042的参数特性使其适用于以下场景:

  1. 工业控制电路:传感器信号调理(如温度、压力传感器的分压电路)、PLC输入输出模块(宽温稳定);
  2. 通信设备:基站射频前端偏置电路(低噪声)、光纤收发器信号滤波(精度要求高);
  3. 消费电子:智能手机音频模块(低噪声)、笔记本电脑电源管理(小功率需求);
  4. 汽车电子:车载仪表盘传感器电路(-40℃~+125℃符合车规延伸需求)、倒车雷达信号处理;
  5. 医疗仪器:监护仪电极信号调理(阻值一致性要求高)、输液泵控制电路(可靠性需求)。

五、可靠性与环境适应性

  • 温漂控制:±25ppm/℃的TCR确保在-55℃~+155℃范围内,阻值变化不超过±0.5%(温度变化100℃时),满足精密电路的稳定要求;
  • 长期稳定性:薄膜电阻的阻值漂移率≤0.1%/1000小时(额定条件下),远优于普通碳膜电阻;
  • 环境合规:符合RoHS 2.0、REACH等环保标准,无铅封装适配绿色制造需求;
  • 抗冲击振动:贴片结构与陶瓷基板结合牢固,可承受10G以上振动(10~2000Hz),适合车载、工业设备等振动场景。

六、品牌与供货保障

Viking(光颉)作为全球知名电阻制造商,ARG系列产品采用标准化生产流程,批量供货一致性达±0.5%(超出标称±1%精度);支持小批量样品申请与大批量订单交付,售后提供参数咨询与应用支持,适合研发与量产阶段的需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.