Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Viking AR05DTCW1002
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Viking AR05DTCW1002
- Type
- VIKING
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 125mW
- Electronic Component
- Electronic Component
- Electronic Component
- VIKING
- Electronic Component
- AR05DTCW1002
- Electronic Component
- 1
- Package
- 0805
- Electronic Component
- SMD Resistor
- Electronic Component
- ±0.5%
- Electronic Component
- 0.029g
- Electronic Component
- 10kΩ
- Electronic Component
- 1
- Electronic Component
- BM0264480868
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 150V
- Electronic Component
- ±25ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
AR05DTCW1002 产品概述
一、产品简介
AR05DTCW1002 为 Viking(光颉) 系列贴片薄膜电阻，封装规格为 0805（约 2.0 × 1.25 mm）。该元件阻值为 10 kΩ，公差 ±0.5%，额定功率 125 mW，适用于对精度与温漂有较高要求的精密电子设计与小功率信号回路。
二、主要电气参数
- 阻值：10 kΩ
- 精度：±0.5%
- 额定功率：125 mW（在规定环境下）
- 最高工作电压：150 V
- 温度系数（TCR）：±25 ppm/°C
- 工作温度范围：-55 ℃ ～ +155 ℃
三、性能特点
- 薄膜工艺提供稳定的阻值与低噪声，适合模拟信号放大、滤波与精密分压电路。
- ±0.5% 公差与 ±25 ppm/°C 的低温漂，保证在温度变化下阻值的高度稳定性。
- 0805 小型封装兼顾了电路板空间利用率与可焊接性，适合自动贴装生产线。
四、典型应用场景
- 精密测量仪器与数据采集前端
- 高频/模拟电路的偏置与反馈网络
- 工业控制、医疗电子及通讯设备中的信号调理模块
- 要求体积小且精度高的消费类电子产品
五、设计与使用建议
- 为延长寿命与提高可靠性，建议按功耗降额使用，避免长期在额定功率附近工作；高温环境下应进一步降额。
- 与常规贴片工艺兼容，推荐采用标准回流焊温度曲线进行焊接；焊接与清洗后建议进行可靠性试验以确认无漂移。
- 在高阻值或高电压应用中注意爬电距离与电气间隙设计，保证工作电压不超过 150 V。
- 储存应避免潮湿与腐蚀性气体，遵循正常的元器件防潮与防静电管理。
本产品适合对精度、稳定性要求较高且需要小型化布局的各类电子设备。若需样品、长期可靠性数据或客户化阻值、公差选择，请联系 Viking(光颉) 授权渠道获取详细资料。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
