WMSIC Electronic Components

Viking ARG03FTC2491

ModelARG03FTC2491
Package0603
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG03FTC2491
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG03FTC2491
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
2.49kΩ
Electronic Component
1
Electronic Component
BM0263676857
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ARG03FTC2491 产品概述

一、概述

ARG03FTC2491 是 Viking(光颉)品牌的一款高稳定性贴片薄膜电阻,封装为 0603(1608 公制),标称阻值 2.49 kΩ,精度 ±1%,额定功率 100 mW,工作电压 75 V,温度系数(TCR)仅 ±25 ppm/℃,工作温度范围 -55℃ 至 +155℃。该产品面向高精度、低噪声的线性与测量电路,可满足工业级与仪表级应用对长期稳定性和温漂的严格要求。

二、主要性能亮点

  • 精度与稳定性:±1% 阻值精度结合 ±25 ppm/℃ 的低温漂,使得在变化温度环境下依然能保持优秀的测量一致性和回授精度。
  • 低噪声:薄膜工艺相比碳膜具有更低的额外噪声,适用于放大器前端、精密采样和低频滤波。
  • 宽温度范围:-55℃ 至 +155℃,适应严苛工业及汽车电子环境(请根据实际应用参照可靠性规范)。
  • 封装与功率:0603 小型化封装下实现 100 mW 功率,适合高密度贴装电路板设计。

三、使用与设计要点

  • 电压与功率限制:理论上由功率与阻值决定的连续最大跨端电压约为 V = √(P·R) ≈ √(0.1·2490) ≈ 15.8 V。因此在连续工作条件下,务必以不超过约 15.8 V 为准以避免超过功率极限;规格表中的 75 V 为器件绝对耐压或短时条件下参考值,具体应以厂商数据页为准并避免长期在高压下工作。
  • 温度降额:请按制造商提供的温度–功率降额曲线进行设计。常见做法是在高环境温度下线性降额以保证可靠性。
  • 焊接兼容性:适配无铅回流工艺(建议遵循 J-STD-020 标准曲线),在回流过程中应控制峰值温度与时间以避免热应力。
  • 布局建议:在高精度阻值网络中,对热源与热路径进行布局隔离,避免邻近大电流器件引起自热漂移;并参照厂商推荐的 0603 焊盘尺寸以获得最佳焊接可靠性。

四、典型应用场景

  • 精密放大器与模拟前端(运放反馈、增益设定)
  • 电压采样、分压器与 ADC 前端阻阵列
  • 仪表、测量仪器与传感器桥路(需低漂移与低噪声)
  • 通信设备、便携医疗与工业控制中对体积与精度有要求的电阻元件

五、可靠性与存储/搬运建议

  • 存储环境建议干燥、避免潮湿和腐蚀性气体,贴片器件应在规定的保质期内回流焊接。
  • 搬运时注意避免端电极机械应力或直接挤压,贴片电阻对过度弯曲或碰撞敏感。
  • 建议在贴装与测试过程中采取静电防护措施(ESD),以保护细小结构免受破坏。

如需最终应用设计数据(温度降额曲线、回流曲线、封装焊盘建议、抗湿性与寿命测试报告等),建议索取 ARG03FTC2491 的完整数据手册与可靠性报告,以便在系统级设计中做出准确的热与电应力评估。

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