WMSIC Electronic Components

Viking ARG03FTC1302

ModelARG03FTC1302
Package0603
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG03FTC1302
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG03FTC1302
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
13kΩ
Electronic Component
1
Electronic Component
BM0265636736
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Viking光颉ARG03FTC1302薄膜贴片电阻产品概述

Viking(光颉)ARG03FTC1302是一款针对小功率精密电路设计的0603封装薄膜贴片电阻,凭借高稳定性、宽温适应性及紧凑体积,成为消费电子、工业控制、通信等领域的常用选型之一。以下从核心定位、性能参数、封装特性等维度展开详细概述。

一、产品核心身份与定位

ARG03FTC1302属于光颉ARG03FT系列薄膜电阻,聚焦小信号精密调理场景:既满足消费电子设备的小型化需求,又适配工业级宽温环境的可靠性要求。相比普通碳膜电阻,其薄膜沉积工艺带来更低的温度系数与更高的长期稳定性,是需要精确阻值控制电路的理想选择。

二、关键性能参数解析

该电阻的核心参数直接决定了其应用边界,具体如下:

  • 阻值与精度:标称阻值13kΩ,精度±1%——属于精密级范畴,可满足电压分压、电流采样等需要准确阻值匹配的电路(如传感器信号放大、电源反馈环路);
  • 功率规格:额定功率100mW(0.1W)——适配0603封装的小功率需求,需注意实际使用时应遵循功率降额原则(建议不超过额定功率的50%,即50mW),避免长期过负荷导致性能衰减;
  • 工作电压:额定工作电压75V,但需结合功率计算实际安全电压上限:由( P=V^2/R )推导,最大安全电压约为( \sqrt{0.1W \times 13000Ω} ≈ 36V ),实际应用中需以功率降额后的电压为限;
  • 温度系数:±25ppm/℃——薄膜电阻的典型优势,阻值随温度变化的幅度远低于碳膜电阻(通常碳膜为±200ppm/℃以上),适合温变敏感场景(如户外工业传感器);
  • 工作温度范围:-55℃~+155℃——覆盖工业级宽温区间,可稳定工作于极端低温(如北方户外设备)或高温(如高温车间设备)环境。

三、封装与物理特性

ARG03FTC1302采用0603封装(英制尺寸:0.06英寸×0.03英寸,公制尺寸:1.6mm×0.8mm),具备以下物理优势:

  • 小型化:体积紧凑,可显著节省PCB空间,适配智能手机、智能穿戴等便携设备的高密度布局;
  • 贴装兼容性:表面贴装式设计,支持自动化贴装产线,提高生产效率;
  • 结构可靠性:基于陶瓷基底的薄膜沉积工艺,抗振动、抗冲击性能优于传统插件电阻,适合移动设备或工业振动环境。

四、典型应用场景

ARG03FTC1302的性能匹配多领域需求,常见应用包括:

  1. 消费电子:智能手机/平板电脑的音频电路、传感器接口(如加速度计、陀螺仪的分压电路);
  2. 工业控制:PLC(可编程逻辑控制器)的模拟量输入调理、小型电机驱动的电流采样;
  3. 通信设备:基站射频前端的信号衰减、路由器的电源滤波电路;
  4. 医疗设备:小型家用医疗仪器(如血糖仪、血压计)的精密测量电路;
  5. 汽车电子:辅助小功率电路(如车内传感器信号调理,需注意需确认车规认证需求,若有则需选对应车规系列)。

五、可靠性与环境适应性

该电阻的可靠性设计针对工业级需求优化:

  • 宽温稳定性:-55℃~+155℃范围内阻值变化小,长期工作无明显漂移;
  • 抗环境干扰:薄膜电阻的耐湿性、耐腐蚀性优于碳膜电阻,可在湿度≤85%RH的环境下稳定工作;
  • 寿命表现:遵循功率降额原则时,预期寿命可达10万小时以上,满足设备长期运行需求。

六、选型与应用注意事项

为确保ARG03FTC1302的性能发挥,需注意以下要点:

  1. 功率降额:实际功率需≤50mW(额定功率的50%),避免过负荷导致阻值漂移或失效;
  2. 电压限制:实际工作电压需≤36V(功率降额后的安全电压),勿超额定75V直接使用;
  3. 贴装工艺:0603封装需注意贴装精度,避免虚焊或桥接,建议采用回流焊工艺;
  4. 精度匹配:若需更高精度(如0.1%)或更低温度系数(如±10ppm/℃),需切换至光颉更高端系列;
  5. 环境适配:避免在强腐蚀(如含硫气体)环境下长期使用,若有需做防护处理。

综上,Viking光颉ARG03FTC1302是一款高性价比的精密薄膜贴片电阻,平衡了小型化、高精度与宽温适应性,可满足多领域小功率精密电路的核心需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.