WMSIC Electronic Components

Viking ARG03DTC6402N

ModelARG03DTC6402N
Package0603
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG03DTC6402N
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG03DTC6402N
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±0.5%
Electronic Component
0.023g
Electronic Component
64kΩ
Electronic Component
1
Electronic Component
BM0227627287
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ARG03DTC6402N 薄膜贴片电阻产品概述

ARG03DTC6402N是光颉(Viking)电子推出的一款高性能精密薄膜贴片电阻,针对小型化、高精度电子电路设计优化,兼顾宽温适应性与长期稳定性,广泛适配消费电子、工业控制、通信等领域的高密度PCB布局需求。

一、产品核心定位与基础属性

ARG03DTC6402N属于工业级精密薄膜电阻范畴,以0603通用贴片封装为载体,核心围绕“高稳定性、高精度、小体积”三大特性设计,是替代传统厚膜电阻、满足小型化精密电路需求的优选方案。其标称阻值64kΩ,额定功率100mW,最大工作电压75V,精度与温度系数均达到工业级精密电阻标准。

二、关键参数详解

ARG03DTC6402N的参数设计精准匹配精密电路需求,各核心参数的实际意义与价值如下:

  1. 阻值与精度:标称阻值64kΩ,精度±0.5%——实际阻值偏差控制在±320Ω以内,可满足信号调理、分压、偏置等需要精准阻值匹配的电路(如音频前置放大、传感器信号校准);
  2. 功率与电压:额定功率100mW,最大工作电压75V——需遵循降额原则(工业场景建议降额20%,即最大实际功率≤80mW),避免过热导致阻值漂移;电压限制75V为直流/交流峰值,超压可能引发击穿;
  3. 温度系数(TCR):±25ppm/℃——温度每变化1℃,阻值变化±25×10⁻⁶。以125℃工作温度为例,相对于25℃基准的阻值变化为0.25%,结合初始精度0.5%,总偏差可控制在±0.75%以内,稳定性显著优于普通厚膜电阻;
  4. 工作温度范围:-55℃+155℃——覆盖工业级(-40℃+85℃)、部分高温场景(如汽车辅助电路)的温度需求,长期使用无明显性能衰减。

三、封装与工艺优势

ARG03DTC6402N采用0603贴片封装(英制:0.06英寸×0.03英寸,公制:1.6mm×0.8mm),具备以下核心优势:

  1. 小型化适配:体积仅为传统直插电阻的1/10,可大幅提升PCB布局密度,适配智能手机、智能穿戴、小型通信模块等对空间要求苛刻的产品;
  2. 薄膜工艺特性:采用真空溅射技术在高纯度氧化铝陶瓷基底上沉积镍铬电阻膜,相比厚膜电阻(丝网印刷工艺),具备更低噪声(典型值<1nV/√Hz)、更窄TCR分布,1000小时老化后阻值漂移<0.1%;
  3. 焊接兼容性:符合IPC-J-STD-020标准,支持回流焊、波峰焊等主流贴片工艺,焊接后无开裂、阻值异常问题。

四、典型应用场景

ARG03DTC6402N因高精度、小体积、宽温特性,可广泛应用于:

  1. 消费电子:智能手机/平板的音频信号调理、电源分压、摄像头模组偏置电路;
  2. 工业控制:PLC模拟量模块、传感器信号放大、温度补偿电路;
  3. 通信设备:基站射频前端滤波、路由器/交换机信号衰减、光模块偏置电路;
  4. 测试仪器:示波器/信号发生器校准、万用表分压网络。

五、可靠性与选型注意事项

  1. 可靠性验证:通过光颉内部1000小时高温负载测试、-55℃~+155℃循环500次温度测试,阻值漂移、TCR变化符合工业级标准;
  2. 选型注意事项:
    • 实际功率需降额(工业≥20%,消费≥10%);
    • 若工作电压接近75V,需确认电流≤1.17mA(75V/64kΩ),避免功率过载;
    • 存储需干燥环境(湿度≤60%),避免受潮影响焊接与阻值稳定性。

总结:ARG03DTC6402N是一款性能均衡的精密薄膜贴片电阻,兼顾小型化与高精度,可满足多数工业级与消费级精密电路需求,是光颉电子在精密电阻领域的代表性产品之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.