Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
AR05FTBW0500 是 Viking(光颉) 系列的一款贴片薄膜电阻,阻值为 50Ω,公差 ±1%,额定功率 125mW,封装为 0805。凭借薄膜工艺与紧凑封装,该型号在精密阻值控制、温度稳定性和高频性能上具备显著优势,适合对精度和可靠性有较高要求的电子设计。
0805 封装适用于常规 SMT 贴装流程。为确保可靠焊接与性能稳定,建议:遵循器件厂商的回流焊温度曲线;在设计焊盘与过孔时参考厂方推荐尺寸以降低焊接应力;进行适当的清洗与干燥处理以避免潮湿对薄膜层的影响。若需多次回流或波峰焊,请事先与供应商确认耐热性。
本器件工作温度范围宽(-55℃ 至 +155℃),适应严苛环境。额定工作电压 150V 与 125mW 功率限制需在电路设计时留有裕量,避免长期超负荷工作。薄膜结构在长期使用中表现出较好的阻值保持性和抗热循环能力。
AR05FTBW0500 由 Viking(光颉) 生产,适合对精度、稳定性和低温漂有较高要求的设计。常见包装形式为卷带供贴片机使用,具体包装、最小起订量与交期请与供应商确认。若项目需更严格的寿命或环境测试报告,可向厂商申请额外的可靠性数据或样品验证。
如需获取产品详细数据表(含尺寸图、焊接建议、可靠性测试结果)或样品评估,建议联系 Viking(光颉) 或其授权分销商。设计过程中如对功率裕量、热沉设计或高频特性有疑问,可咨询工程支持以获得最佳应用建议。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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