WMSIC Electronic Components

Viking AR03BTCX1401

ModelAR03BTCX1401
Package0603
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking AR03BTCX1401
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
AR03BTCX1401
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.023g
Electronic Component
1.4kΩ
Electronic Component
1
Electronic Component
BM0265378806
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Viking光颉AR03BTCX1401薄膜贴片电阻产品概述

一、产品基本定位与型号解析

AR03BTCX1401是光颉(Viking)推出的工业级高精度薄膜贴片电阻,属于该品牌AR系列精密电阻范畴,专为需要稳定阻值、宽温适应性的电子电路设计。型号各部分含义解析:

  • AR03:系列标识,代表光颉精密薄膜电阻系列(针对0603封装优化);
  • BTCX:封装与工艺代码,对应0603(英制)贴片封装;
  • 1401:阻值代码,前三位为有效数字(140),第四位为倍率(10¹),即140×10¹=1400Ω=1.4kΩ。

二、核心性能参数详解

该电阻的关键参数围绕高精度、宽温稳定设计,具体如下:

参数项 规格值 关键说明 电阻类型 金属薄膜电阻 真空溅射工艺,阻值稳定性优于厚膜 标称阻值 1.4kΩ(1400Ω) 阻值代码1401直接对应 精度等级 ±0.1% 工业级高精度标准(远高于常规碳膜±5%) 额定功率 100mW(25℃) 环境温度25℃下的最大允许功率 推荐工作功率 ≤62.5mW 62.5%降额设计,保障长期可靠性 最大允许电压 75V 过压保护阈值(需结合功率验证) 温度系数(TCR) ±25ppm/℃ 温度变化对阻值的影响(值越小越稳定) 工作温度范围 -55℃~+155℃ 覆盖工业级与汽车级温度要求 封装规格 0603(英制) 公制1608,尺寸1.6mm×0.8mm×0.45mm

三、封装设计与工艺优势

  1. 小体积高密度:0603封装体积仅1.6mm×0.8mm,适合智能手机、汽车电子等空间受限的高密度PCB设计;
  2. 薄膜工艺核心优势:采用金属薄膜真空溅射技术,相比厚膜电阻具有:
    • 低噪声(典型<-40dB),适合模拟信号电路;
    • 高频特性优异(截止频率可达数GHz),满足射频电路阻抗匹配需求;
    • 长期阻值漂移小(负载寿命1000小时后漂移<0.1%);
  3. 环保焊接兼容:端电极采用“镍-铜-锡”三层结构,支持回流焊、波峰焊自动化生产,无铅环保符合RoHS 2.0与REACH指令。

四、环境适应性与可靠性验证

  1. 宽温稳定性:工作温度-55℃~+155℃,温度变化100℃时阻值漂移仅±35Ω(由TCR±25ppm/℃控制),适合户外设备、汽车发动机舱等恶劣环境;
  2. 抗机械应力:无引线贴片封装,抗振动(10G,50-2000Hz)与冲击(1000G,0.1ms)能力优于插件电阻,适合车载、航空航天场景;
  3. 长期可靠性测试:通过光颉内部严格验证:
    • 高温负载(125℃,1000小时):阻值漂移<0.1%;
    • 湿热(85℃/85%RH,1000小时):阻值变化<0.2%;
    • 温度循环(-55℃~+155℃,1000次):无开路/短路,阻值稳定。

五、典型应用场景

AR03BTCX1401凭借高精度、宽温稳定特性,广泛应用于:

  1. 精密测量仪器:示波器、万用表、频谱分析仪的校准参考电路;
  2. 工业控制:PLC输入输出接口、传感器信号调理(压力/温度传感器分压网络);
  3. 汽车电子:车身控制单元(BCM)、胎压监测(TPMS)、发动机管理(EMS)信号电路;
  4. 通信设备:基站射频前端、路由器电源滤波、光纤收发器阻抗匹配;
  5. 医疗设备:监护仪、输液泵的精密模拟电路(低噪声、高稳定需求)。

六、选型与使用注意事项

  1. 功率降额:实际工作功率≤62.5mW(避免高温下阻值漂移);
  2. 电压验证:最大允许电压75V,若电压接近上限,需确认功率是否在100mW以内(V=√(P×R));
  3. 焊接规范:回流焊峰值温度≤260℃(持续≤10秒),波峰焊温度≤250℃(持续≤5秒);
  4. 存储条件:常温干燥(-40℃~+60℃,湿度≤60%),存储时间≤12个月。

该电阻平衡了高精度、小体积与宽温适应性,是工业控制、汽车电子等领域的高性价比选型。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.