WMSIC Electronic Components

Viking ARG03FTC1203

ModelARG03FTC1203
Package0603
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG03FTC1203
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG03FTC1203
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
120kΩ
Electronic Component
1
Electronic Component
BM0265636714
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ARG03FTC1203薄膜贴片电阻产品概述

ARG03FTC1203是光颉电子(Viking) 推出的一款高精度薄膜贴片电阻,采用0603封装设计,专为小型化、高稳定性电路场景打造。产品结合薄膜电阻技术的优势,在精度、温度稳定性及宽温适应性方面表现突出,可满足消费电子、工业控制等多领域的应用需求。

一、产品基本信息

ARG03FTC1203属于贴片式薄膜电阻,由光颉电子(国内知名被动元器件制造商)研发生产。型号命名逻辑清晰:

  • "ARG03"对应0603封装(英制60mil×30mil,公制1.6mm×0.8mm);
  • "FTC"代表薄膜(Film)电阻技术;
  • "1203"表示阻值为120kΩ(120×10³Ω)。

产品采用表面贴装工艺,可兼容自动化贴装生产线,适合批量生产中的高密度PCB布局。

二、核心性能参数解析

ARG03FTC1203的关键参数经过优化,适配多数中小功率电路的需求:

参数类别 具体参数 关键说明 电阻类型 薄膜电阻 真空溅射工艺制造,比碳膜/金属膜电阻噪声更低、长期稳定性更优 标称阻值 120kΩ 符合国际电阻标识规范,无额外并联/串联组合 精度等级 ±1% 阻值偏差控制在±1%以内,满足常规高精度电路的一致性要求 额定功率 100mW 适合小功率信号处理、偏置电路等场景,避免过载风险 额定工作电压 75V 最大连续工作电压为75V,超过此值需按降额曲线使用 温度系数(TCR) ±25ppm/℃ 每变化1℃,阻值变化≤25×10⁻⁶,在宽温范围内阻值稳定性优异 工作温度范围 -55℃~+155℃ 覆盖工业级宽温场景,可应对低温存储、高温运行等极端环境 封装尺寸 0603(英制) 体积小巧(1.6mm×0.8mm),节省PCB空间,适配便携式设备、小型模块设计

三、设计特点与优势

  1. 高精度与低漂移
    ±1%的精度等级可满足多数电路的参数一致性要求,无需额外校准;±25ppm/℃的温度系数使阻值随温度变化极小(如120kΩ电阻在100℃温差下仅变化3Ω),适合传感器信号调理、精密放大等对阻值稳定性敏感的应用。

  2. 宽温环境适应性
    工作温度范围覆盖-55℃至+155℃,远超常规商业级电阻(0℃~70℃),可用于工业控制、车载辅助电路等极端温度场景,无需额外散热或温度补偿。

  3. 小体积高密度布局
    0603封装体积仅1.6mm×0.8mm,可大幅提升PCB的元件密度,适配智能手机、智能穿戴、小型通信模块等便携式设备的设计需求。

  4. 低噪声与高可靠性
    薄膜电阻采用真空溅射工艺,相比碳膜电阻噪声降低约10dB,适合音频设备、医疗仪器等对噪声敏感的场景;产品经过光颉电子的可靠性测试(如温度循环、湿度老化、负载寿命测试),符合RoHS环保标准,批量一致性优异。

四、典型应用场景

ARG03FTC1203的性能适配多领域需求,常见应用包括:

  1. 消费电子:智能手机/平板的信号滤波电路、音频前置放大偏置电阻、智能穿戴设备的传感器接口;
  2. 工业控制:PLC模块的电阻网络、传感器信号调理电路、小型电机驱动的限流辅助电阻;
  3. 通信设备:小型基站的阻抗匹配电阻、路由器的电源滤波电路;
  4. 汽车电子(辅助场景):车载仪表盘的背光控制电阻、小型传感器(如温度传感器)的信号调理;
  5. 医疗仪器:便携式血糖仪、血压计的信号处理电路(低噪声需求适配)。

五、品牌与可靠性保障

光颉电子(Viking)是国内专注于被动元器件研发生产的企业,薄膜电阻生产线采用国际先进的真空溅射、激光调阻技术,产品精度控制稳定。ARG03FTC1203经过以下可靠性验证:

  • 温度循环测试(-55℃~+155℃,循环500次):阻值变化≤0.5%;
  • 负载寿命测试(100℃下施加额定功率1000小时):阻值变化≤0.2%;
  • 湿度测试(85℃/85%RH,1000小时):阻值变化≤0.3%。

产品符合RoHS 2.0、REACH等环保标准,可满足全球市场的合规要求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.