Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ARG05BTC4701是光颉(Viking)电子推出的高精度小功率薄膜贴片电阻,针对高密度电路设计与精密信号处理场景优化,具备宽温稳定性、低温度系数等核心优势,广泛适配工业控制、仪器仪表、通信设备等领域的应用需求。
ARG05BTC4701属于薄膜电阻范畴,采用真空沉积镀膜工艺制备电阻层,相比厚膜电阻具有更高的精度与温度稳定性。产品为贴片式封装,便于自动化贴装生产,是低功耗精密电路的理想选择。
ARG05BTC4701的关键参数精准满足中高端电子设备的设计要求,具体如下:
ARG05BTC4701采用0805封装(英制尺寸:0.08英寸×0.05英寸),换算为公制尺寸为2.0mm×1.2mm,焊盘间距适配标准PCB设计。该封装体积小、重量轻,可有效提升PCB板的集成度,适合高密度电路布局(如智能手机、小型化仪器等)。
结合ARG05BTC4701的性能特点,其核心应用场景包括:
光颉(Viking)作为全球知名电阻制造商,ARG05BTC4701具备以下可靠性优势:
为确保ARG05BTC4701的性能稳定与寿命,需注意以下要点:
综上,ARG05BTC4701凭借高精度、宽温稳定、小体积等特点,成为精密电子电路设计的高性价比选择,可有效提升设备性能与可靠性。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products