WMSIC Electronic Components

Viking ARG05BTC3000

ModelARG05BTC3000
Package0805
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG05BTC3000
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG05BTC3000
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.029g
Electronic Component
300Ω
Electronic Component
1
Electronic Component
BM0264911619
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ARG05BTC3000 薄膜贴片电阻产品概述

一、产品定位与核心特性

ARG05BTC3000是Viking(光颉)针对精密电子电路推出的高性能薄膜贴片电阻,核心聚焦“高精度、宽温稳定、小封装适配”三大优势,可替代传统低精度电阻满足工业级、医疗级等场景的严苛需求。其核心亮点包括:

  • 阻值精度达±0.1%,实现精密信号调理;
  • 温度系数低至±25ppm/℃,温度波动对阻值影响极小;
  • 0805小封装,适配高密度PCB布局;
  • 工业级宽温范围(-55℃~+155℃),适应极端工作环境。

二、关键电气性能参数详解

ARG05BTC3000的电气参数经过严格校准,核心指标可支撑多数精密场景应用:

1. 阻值与精度

标称阻值300Ω,精度±0.1%,实际阻值范围为299.7Ω~300.3Ω,可满足示波器、数字万用表等设备的校准级阻值要求,批量一致性优于普通金属膜电阻。

2. 功率与电压限制

  • 额定功率125mW(25℃环境下),实际使用需遵循“温度升额功率降额”原则(如100℃时功率降额至约80mW);
  • 最大连续工作电压150V,根据(P=V^2/R)计算,150V下实际功耗仅75mW(远低于额定功率),因此电压限制优先于功率限制。

3. 温度系数(TCR)

±25ppm/℃表示每升高1℃,阻值变化±25×10⁻⁶Ω。例如:当工作温度从25℃升至125℃(变化100℃),阻值变化仅**±0.25%**,远优于普通碳膜电阻(典型±100ppm/℃以上)。

4. 噪声特性

薄膜电阻采用真空沉积工艺,电流噪声典型值<0.1μV/V,适合低噪声信号处理电路(如音频放大器、传感器前端)。

三、物理与环境适应性

1. 封装与尺寸

采用0805英制贴片封装,尺寸为2.0mm(长)×1.2mm(宽)×0.5mm(厚),适配常规SMT贴装工艺,支持高密度PCB布局(如手机、路由器等小型化设备)。

2. 宽温可靠性

工作温度范围-55℃+155℃,符合工业级I级温度标准,可稳定工作于汽车发动机舱(-40℃+125℃)、户外基站(-20℃~+55℃)等极端场景。

3. 抗环境干扰

环氧树脂封装+薄膜电阻层设计,具备抗潮湿(湿度范围095%RH)、抗振动(102000Hz,加速度2g)性能,长期工作漂移率<0.05%/1000小时。

四、典型应用场景

ARG05BTC3000因高精度、宽温稳定特性,广泛覆盖以下领域:

1. 精密仪器仪表

示波器、函数发生器、数字万用表等设备的信号校准电路,需准确阻值保证测量精度。

2. 医疗电子设备

监护仪、血糖仪、输液泵的信号调理模块,对阻值一致性要求高,且需适配低温(如冷链设备)环境。

3. 通信设备

基站射频模块、路由器信号滤波电路,小封装适配高密度PCB,宽温满足户外基站的温度波动。

4. 汽车电子

车身控制模块(BCM)、胎压传感器信号处理电路,适应汽车-40℃~+125℃的工作环境。

5. 工业控制

PLC模块、伺服驱动器的反馈电路,宽温范围满足工业现场(如车间、油田)的温度变化。

五、品牌与品质保障

Viking(光颉)作为专业被动元件制造商,ARG系列电阻通过以下品质控制:

  • 全流程自动化生产,阻值分选精度达±0.05%,确保批量一致性;
  • 符合RoHS、REACH环保标准,无铅无卤,适配绿色电子产品;
  • 提供完整测试报告(含温度特性、功率老化测试),支持客户可靠性验证。

ARG05BTC3000凭借“高精度+宽温稳定+小封装”的综合优势,成为精密电子领域的高性价比选择,可有效提升电路性能的一致性与可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.