WMSIC Electronic Components

Viking ARG02BTC8201

ModelARG02BTC8201
Package0402
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG02BTC8201
Type
VIKING
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG02BTC8201
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.009g
Electronic Component
8.2kΩ
Electronic Component
1
Electronic Component
BM0265378701
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ARG02BTC8201薄膜贴片电阻产品概述

一、产品核心定位与品牌背景

ARG02BTC8201是Viking(光颉) 推出的高精度薄膜贴片电阻,属于该品牌薄膜电阻系列的常规型号,主打小封装、高精度、宽温稳定 特性,适配对阻值偏差、环境适应性要求严格的电子设备设计。光颉作为专业被动元器件厂商,其薄膜电阻产品在工业控制、通信等领域应用广泛,ARG02BTC8201延续了品牌在小封装高精度电阻上的技术积累,是替代普通碳膜/合金电阻的高性价比选择。

二、关键技术参数详解

ARG02BTC8201的核心参数围绕「精密稳定」设计,具体如下:

  • 阻值与精度:标称阻值8.2kΩ,精度±0.1%,属于行业高精度等级,满足传感器信号调理、基准电压电路等对阻值偏差的严格要求(避免电路性能漂移);
  • 功率与电压:额定功率62.5mW,最大工作电压50V,适配低功耗电路场景,可避免过功率/过电压损坏;
  • 温度系数(TCR):±25ppm/℃,表示温度每变化1℃,阻值变化不超过25ppm(即8.2kΩ变化约0.205Ω),远优于普通碳膜电阻,确保宽温环境下阻值稳定;
  • 工作温度范围:-55℃~+155℃,覆盖工业级、汽车级(部分场景)温区,适应极端环境应用(如工业炉旁、寒冷地区户外设备)。

三、封装与物理特性

该电阻采用0402封装(英制尺寸:长0.04英寸=1.016mm,宽0.02英寸=0.508mm),是贴片电阻中尺寸较小的封装类型,核心优势在于:

  • 节省PCB空间:适配便携式电子(智能手机、可穿戴设备)、高密度PCB设计(如服务器主板);
  • 工艺兼容性强:支持回流焊、波峰焊等常规SMT工艺,焊接可靠性经行业验证;
  • 低寄生参数:无引脚设计降低电感、电容寄生,适合高频电路(如射频匹配网络)。

四、性能优势分析

ARG02BTC8201的性能优势可总结为「小、准、稳、广」:

  1. 小封装:0402封装满足设备小型化趋势,尤其适合体积受限的消费电子、医疗设备;
  2. 高精度:±0.1%的阻值精度可减少电路校准环节,简化设计流程;
  3. 宽温稳定:±25ppm/℃的TCR+宽温区,确保极端温度下阻值偏差可控(如汽车发动机舱附近的辅助电路);
  4. 低噪声:薄膜电阻固有特性(相比碳膜),噪声水平低,适合信号调理、音频电路。

五、典型应用场景

ARG02BTC8201的参数特性使其适配以下场景:

  • 消费电子:智能手机信号调理电路、无线耳机电源分压电路、平板电脑传感器模块;
  • 工业控制:PLC输入输出模块精密分压、传感器信号放大电路、工业仪器仪表基准电路;
  • 通信设备:基站射频前端匹配网络、光模块偏置电路、路由器信号滤波电路;
  • 汽车电子:胎压监测模块分压电路、车内温度传感器信号调理(需确认具体车型温区要求)。

六、可靠性与环境适应性

该电阻采用薄膜电阻技术,相比碳膜电阻具有更高的长期稳定性:

  • 长期漂移小:经加速老化测试,阻值漂移率符合工业级可靠性标准(≤0.05%/1000小时);
  • 焊接可靠性:0402封装可承受多次回流焊(≥3次),无虚焊、脱落风险;
  • 环境耐受性:宽温区设计+薄膜结构,抗潮湿、抗振动性能优于普通电阻,适应工业现场复杂环境。

综上,ARG02BTC8201以小封装、高精度、宽温稳定为核心竞争力,覆盖多领域电子设备的精密电路需求,是高性价比的薄膜贴片电阻选型。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.