WMSIC Electronic Components

Viking ARG05DTC2000

ModelARG05DTC2000
Package0805
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG05DTC2000
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG05DTC2000
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±0.5%
Electronic Component
0.029g
Electronic Component
200Ω
Electronic Component
1
Electronic Component
BM0265966184
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Viking光颉ARG05DTC2000薄膜电阻产品概述

一、产品定位与核心类别

ARG05DTC2000是Viking(光颉)推出的0805封装薄膜固定电阻,属于该品牌通用高精度电阻系列的典型型号。其核心定位是兼顾精度、稳定性与成本的实用型电阻,适用于对阻值误差、温度漂移要求高于普通碳膜电阻,但无需超高精度(如±0.1%)的电子电路场景。作为薄膜电阻,它采用真空沉积或溅射工艺形成电阻层,相比碳膜/金属氧化膜电阻,具有更窄的阻值公差范围、更低的温度系数(TCR)及更优的长期稳定性,是消费电子、工业控制等领域的高性价比选择。

二、关键性能参数详解

ARG05DTC2000的核心参数直接决定了其应用边界,关键指标及实际意义如下:

  • 阻值与精度:标称阻值200Ω,精度±0.5%——该精度等级可满足多数工业控制、消费电子的信号调理需求,避免因阻值偏差导致的信号失真或控制误差;
  • 功率与电压:额定功率125mW,额定工作电压150V——经计算,150V电压下的功耗为(150²/200)=112.5mW,低于额定功率,可安全长期工作;
  • 温度系数(TCR):±25ppm/℃——表示温度每变化1℃,阻值变化约5μΩ(200Ω×25e-6),在全温区内最大漂移仅1.05Ω(漂移率0.525%),远优于普通电阻;
  • 工作温度范围:-55℃~+155℃——覆盖工业级、车载(非发动机舱)环境的温度波动,可适应低温存储、高温工作的恶劣工况。

三、封装与物理特性

ARG05DTC2000采用0805表面贴装封装(英制0.08×0.05英寸,公制2012),物理尺寸约2.0mm(长)×1.2mm(宽)×0.5mm(厚),重量约0.01g。该封装是电子行业最常用的小型化封装之一,适配自动化贴装设备(SMT),支持高速生产;同时,0805封装的陶瓷基底散热能力可满足125mW额定功率需求,避免局部过热导致的性能下降。

四、典型应用场景

ARG05DTC2000的参数特性使其适配多领域电路:

  1. 消费电子:手机、平板、智能穿戴的电源滤波、信号分压电路——小型化封装适合紧凑设计,精度保障信号质量;
  2. 工业控制:PLC模拟量输入调理、传感器信号放大电路——宽温区与低TCR适应工业现场温度波动;
  3. 通信设备:路由器、交换机的电源管理、射频前端辅助电路——125mW功率满足低功耗模块需求;
  4. 汽车电子:车载中控背光调节、按键信号处理——-55℃~+155℃温区覆盖车载环境(非发动机舱场景)。

五、可靠性与品质保障

Viking作为专注被动元件的品牌,ARG05DTC2000的可靠性通过多项测试验证:

  • 长期稳定性:薄膜电阻层无碳膜老化漂移问题,1000小时高温负载测试(125℃+额定功率)阻值变化≤0.1%;
  • 耐湿性:符合IEC 60068-2-67湿热测试标准,85℃/85%RH环境1000小时后阻值变化≤0.2%;
  • 机械强度:陶瓷基底抗冲击性强,可通过MIL-STD-202跌落、振动测试。

六、品牌与选型参考

Viking(光颉)是台湾知名被动元件制造商,专注电阻、电容研发30余年,产品覆盖全球电子行业。ARG05DTC2000属于其ARG系列薄膜电阻,若需更高精度(±0.1%)、更低TCR(±10ppm/℃)或更大功率(200mW),可参考同系列ARG06DTC、ARG07DTC型号;若对成本敏感,可考虑普通碳膜电阻,但需接受更高阻值漂移与精度公差。

该产品凭借均衡的性能与可靠性,成为中小功率电子电路中替代普通电阻的优选方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.