WMSIC Electronic Components

Viking ARG05FTC4702

ModelARG05FTC4702
Package0805
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG05FTC4702
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG05FTC4702
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.029g
Electronic Component
47kΩ
Electronic Component
1
Electronic Component
BM0265378718
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Viking光颉ARG05FTC4702薄膜贴片电阻产品概述

Viking光颉ARG05FTC4702是一款专为高密度电子设计打造的0805封装高精度薄膜贴片电阻,核心定位于工业控制、消费电子、汽车电子等领域的信号调理与功率管理场景,以稳定的宽温性能、精准的阻值控制及小体积设计为核心优势。

一、产品基本定位与核心参数

ARG05FTC4702属于光颉ARG系列薄膜电阻,针对中低功率、高精度需求优化。其核心参数清晰明确:

  • 阻值:47kΩ(标准E96系列阻值,适配多数电路设计)
  • 精度:±1%(满足精密分压、限流需求,无需额外校准)
  • 功率:125mW(25℃环境下额定功耗)
  • 额定电压:150V(需结合功率约束实际使用)
  • 温度系数:±25ppm/℃(宽温下阻值漂移极小)
  • 工作温度范围:-55℃~+155℃(覆盖工业、汽车极端环境)

二、关键性能指标详解

(1)精度与温度稳定性

ARG05FTC4702采用金属薄膜工艺(真空溅射沉积电阻层),相比普通碳膜电阻精度提升3倍以上。温度系数仅±25ppm/℃,例如环境温度从25℃升至125℃(变化100℃),阻值漂移仅117.5Ω,相对误差不足0.25%,可满足传感器调理、医疗设备等对稳定性要求较高的场景。

(2)功率与电压约束

额定功率125mW需与电压限制结合:

  • 功率限制:最大电流≈1.63mA,对应电压≈76.6V;
  • 电压限制:150V功耗≈0.478W(超额定功率),实际最大电压需以功率约束为准(≈76.6V),避免过热损坏。

(3)宽温适应性

-55℃~+155℃的工作范围,覆盖汽车发动机舱、户外PLC等极端环境,低温下阻值漂移仍≤0.1%,性能稳定可靠。

三、封装与物理特性

(1)封装规格

采用0805贴片封装(英制:0.08×0.05英寸;公制:2.0×1.2mm),适配主流贴片机,大幅节省PCB空间,适合智能手机、路由器等高密度设备。

(2)工艺与尺寸

  • 常规尺寸:长度2.0±0.2mm,宽度1.2±0.2mm,厚度0.5±0.1mm;
  • 工艺:金属薄膜+陶瓷基底,低噪声、低寄生参数,适合高频信号处理;
  • 焊盘兼容性:符合IPC标准,回流焊峰值温度260℃/10秒,可靠性强。

四、典型应用场景

ARG05FTC4702凭借核心优势,广泛适配以下场景:

  1. 工业控制:PLC输入分压、温度传感器调理、电机驱动限流;
  2. 消费电子:手机充电电压检测、音频滤波、智能手表电源管理;
  3. 汽车电子:车载中控信号衰减、仪表盘背光控制、胎压监测偏置;
  4. 通信设备:路由器射频偏置、交换机端口限流、基站信号调理。

五、可靠性与品质保障

(1)环境可靠性

  • 耐湿测试:90%RH/40℃下1000小时,阻值变化≤0.5%;
  • 温度循环:-55℃~+155℃循环1000次,漂移≤0.2%;
  • 回流焊:通过JEDEC J-STD-020标准,兼容主流制程。

(2)品牌与认证

  • 品牌:Viking光颉专注精密电阻20余年,全球知名供应商;
  • 认证:ISO 9001、ISO/TS 16949(汽车级),符合RoHS/REACH环保要求(无铅无卤)。

六、总结

Viking光颉ARG05FTC4702是一款高性价比的高精度薄膜电阻,以0805小封装实现了±1%精度、±25ppm/℃温度系数及宽温范围,完美适配多领域精密电路设计,是工程师优化性能、降低成本的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.