WMSIC Electronic Components

Viking ARG05BTC0330

ModelARG05BTC0330
Package0805
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG05BTC0330
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG05BTC0330
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.029g
Electronic Component
33Ω
Electronic Component
1
Electronic Component
BM0264911551
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ARG05BTC0330 薄膜贴片电阻产品概述

一、产品基本属性与品牌背景

ARG05BTC0330是Viking光颉推出的高精度薄膜贴片电阻,属于该品牌ARG系列的核心型号。光颉作为专注被动元器件的专业厂商,在薄膜电阻领域具备成熟的研发与制造能力,ARG系列主打“小体积+高精度+高稳定性”,广泛覆盖工业级、精密仪器等对阻值一致性要求严苛的场景。该型号以0805封装为核心,阻值33Ω,是电子设备中信号调理、电源反馈等模块的常用选型。

二、关键性能参数详解

ARG05BTC0330的参数设计围绕“精密稳定”核心,具体特性如下:

  • 阻值与精度:标称阻值33Ω,精度±0.1%——远高于普通碳膜电阻(通常±1%~±5%),可满足万用表校准、传感器信号放大等对阻值误差要求极严的场景;
  • 功率与电压:额定功率125mW(0.125W),最大工作电压150V。需注意:实际使用需遵循功率降额原则(建议不超过额定功率的50%,即62.5mW),避免过热导致阻值漂移;
  • 温度系数(TCR):±25ppm/℃——表示温度每变化1℃,阻值变化0.00025%。以工作温度范围(-55℃~+155℃)计算,阻值最大变化量约为0.165Ω,稳定性优异;
  • 工作温度范围:-55℃+155℃——覆盖工业级环境(商业级通常为0℃+70℃),可适应户外、高温车间等极端场景。

三、封装与物理特性

该型号采用0805封装(英制规格,对应公制2012),物理尺寸约2.0mm×1.2mm×0.5mm,具备以下优势:

  • 高密度集成:体积小巧,适合智能手机、医疗设备等对PCB空间要求严格的产品;
  • 表面贴装适配:可通过自动贴片机批量焊接,生产效率高,降低人工成本;
  • 薄膜电阻结构:以陶瓷基片为载体,沉积镍铬合金薄膜并光刻成型——相比碳膜电阻,具有更低噪声、更高稳定性和抗老化能力。

四、典型应用场景

ARG05BTC0330的性能特性使其适配多类精密电路:

  1. 精密仪器仪表:万用表、示波器、信号发生器的校准电路,需高精度阻值保证测量准确性;
  2. 工业控制:PLC模拟量输入模块、传感器信号调理电路,适应工业现场的温度波动;
  3. 消费电子:智能手机、智能手表的电源反馈电路、音频信号分压电路,兼顾小体积与稳定性;
  4. 医疗设备:监护仪、输液泵的精密监测电路,需长期稳定运行且符合高可靠性要求;
  5. 通信设备:基站射频前端的匹配网络、滤波器电路,低温度系数保证信号传输一致性。

五、可靠性与环境适应性

该型号具备优异的可靠性,满足严苛环境需求:

  • 耐温性:陶瓷基片可承受回流焊峰值温度(≤260℃),长期工作温度覆盖工业级;
  • 抗老化:1000小时高温老化后,阻值变化率≤0.1%,长期使用性能稳定;
  • 抗冲击振动:贴片封装与陶瓷基片结合紧密,可承受10g~20g振动,适合车载、航空等领域;
  • 环保合规:符合RoHS、REACH标准,无铅封装,满足全球市场准入要求。

六、选型与使用注意事项

为保证性能与寿命,使用时需注意:

  1. 功率降额:实际功率≤62.5mW,避免过热;
  2. 电压限制:不超过150V最大工作电压,防止击穿;
  3. 焊接工艺:回流焊峰值温度≤260℃,时间≤10秒,避免过温损坏薄膜层;
  4. 静电防护:薄膜电阻对静电敏感,操作时需佩戴防静电手环;
  5. 存储条件:常温干燥环境(15℃35℃,湿度40%60%)存储,避免受潮影响焊接。

ARG05BTC0330凭借“高精度、小体积、宽温稳定”的特性,成为电子设备中精密电路的可靠选型,适配多行业的严苛应用需求。

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