WMSIC Electronic Components

Viking AR03DTC6401N

ModelAR03DTC6401N
Package0603
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking AR03DTC6401N
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
AR03DTC6401N
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±0.5%
Electronic Component
0.023g
Electronic Component
6.4kΩ
Electronic Component
1
Electronic Component
BM0264961712
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AR03DTC6401N 薄膜贴片电阻产品概述

一、产品核心参数梳理

AR03DTC6401N为薄膜贴片电阻,参数围绕精密电路设计做了针对性优化,核心指标如下:

  • 阻值:6.4kΩ(阻值代码6401,对应64×10¹Ω),覆盖中等阻值需求场景;
  • 精度:±0.5%,属于高精密电阻范畴,可避免因阻值偏差导致的信号失真或控制误差;
  • 功率:62.5mW,在0603小封装下实现较高功率密度,适配紧凑空间设计;
  • 工作电压:50V,满足中等电压电路需求,无需额外降额即可稳定工作;
  • 温度系数(TCR):±25ppm/℃,每变化1℃阻值相对漂移25×10⁻⁶,若温度从25℃升至125℃(变化100℃),阻值漂移仅0.25%,稳定性优异;
  • 工作温度范围:-55℃~+155℃,覆盖工业级极端温度场景,适应户外或高温作业环境。

二、封装与品牌背景

封装规格

采用0603英制贴片封装(公制尺寸1.6mm×0.8mm×0.45mm),是小型化电子设备的主流封装之一:适配高密度PCB布局,支持多层板设计,可有效缩小产品体积,满足智能穿戴、小型基站等空间受限场景。

品牌优势

由Viking(光颉) 出品,光颉作为专业被动元件制造商,在薄膜电阻领域具备成熟工艺:通过真空溅射制备的薄膜电阻,相比厚膜电阻具有更低噪声、更好高频特性,且阻值稳定性更优,长期可靠性经行业标准验证。

三、关键性能特点

  1. 高精度+低漂移组合:±0.5%精度与±25ppm/℃ TCR的搭配,是精密仪器、通信设备的核心需求——例如实验室万用表的分流电阻,需长期保持阻值精准以确保测量精度;
  2. 小封装高功率密度:0603封装下承载62.5mW功率,功率密度约11.5mW/mm²,优于部分同封装厚膜电阻,适配智能穿戴等轻薄化设备;
  3. 宽温适应性:-55℃~+155℃工作范围,覆盖工业控制、汽车电子(部分场景)等极端温度,避免温度波动导致的性能波动;
  4. 薄膜电阻固有优势:相比厚膜电阻,线性度更好、寄生电感/电容更低,适合高频信号调理(如射频前端),信号失真更小。

四、典型应用场景

AR03DTC6401N的参数特性适配多类精密电子场景:

  1. 精密仪器仪表:万用表、示波器、信号发生器的校准电路、分压电路,依赖高精度与低漂移确保测量/输出准确;
  2. 通信设备:5G小基站、路由器的信号滤波、阻抗匹配电路,0603封装支持高密度PCB,薄膜特性适配高频信号;
  3. 工业控制模块:PLC的传感器接口、模拟量输入电路,宽温范围适应车间-20℃~+60℃的温度波动;
  4. 消费电子:智能手表、蓝牙耳机的电源管理、传感器信号调理,小封装满足轻薄化需求;
  5. 汽车电子(辅助场景):车载信息娱乐系统的信号处理电路,宽温适配舱内-40℃~+85℃环境。

五、可靠性与选型建议

可靠性说明

光颉的生产工艺确保长期稳定性:经老化测试后阻值漂移控制在±0.1%以内,满足工业级MTBF要求;0603封装焊接可靠性通过JEDEC标准,适配回流焊、波峰焊等常规工艺。

选型建议

  • 若精度要求低于±1%,可换同阻值厚膜电阻(成本更低);
  • 若工作电压超50V,需选高耐压电阻(如100V级);
  • 若功率超62.5mW,建议换0805封装同阻值电阻(功率达125mW)。

该产品凭借高精度、宽温适应性与小封装优势,成为精密电子领域的实用选择,可满足多数工业、通信、消费电子场景的核心需求。

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