WMSIC Electronic Components

Viking ARG03DTC1501

ModelARG03DTC1501
Package0603
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG03DTC1501
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG03DTC1501
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±0.5%
Electronic Component
0.023g
Electronic Component
1.5kΩ
Electronic Component
1
Electronic Component
BM0265378766
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ARG03DTC1501产品概述

一、产品定位

ARG03DTC1501是Viking(光颉)推出的0603封装精密薄膜贴片电阻,专为小型化、高精度电子电路设计打造。该产品针对信号调理、传感器接口、便携设备等对阻值精度、温度稳定性要求较高的场景,兼顾体积紧凑性与性能可靠性,是中高端电子系统的理想电阻组件。

二、核心参数概览

ARG03DTC1501的关键参数完全匹配精密薄膜电阻的应用需求,核心指标如下:

  • 阻值规格:1.5kΩ(标识代码1501)
  • 精度等级:±0.5%(精密级,优于普通碳膜电阻的±5%)
  • 功率容量:100mW(0603封装下的典型功率设计)
  • 工作电压:75V(直流/交流耐压,满足低压电路需求)
  • 温度系数:±25ppm/℃(阻值随温度变化的稳定性指标)
  • 工作温度范围:-55℃~+155℃(宽温覆盖,适配极端环境)
  • 封装尺寸:0603(英制尺寸,对应公制1608,体积仅1.6mm×0.8mm)

三、封装与功率特性

0603封装是ARG03DTC1501的核心体积优势,1.6mm×0.8mm的紧凑尺寸可显著降低电路布局空间,适配便携电子、可穿戴设备等对体积敏感的产品。100mW的功率容量虽属于低功耗设计,但完全满足信号调理、滤波、分压等电路的能量需求(例如,1.5kΩ电阻在100mW下的最大电流约8.16mA,最大电压约12.25V,均在75V耐压范围内)。此外,75V的工作电压覆盖了大部分低压直流/交流电路,避免了耐压不足导致的击穿风险。

四、精度与温度稳定性

ARG03DTC1501的**±0.5%精度是其核心性能亮点,相比普通电阻的±1%、±5%精度,可大幅提升电路的信号准确性(例如,在分压电路中,1.5kΩ与10kΩ电阻串联时,精度差异直接影响输出电压的偏差)。同时,±25ppm/℃的温度系数**进一步强化了阻值稳定性:当环境温度从-55℃变化至+155℃(温差210℃),阻值变化仅约±0.525%,远低于工业级电阻的常见要求(通常≤50ppm/℃),可在宽温环境下保持电路性能一致性。

五、典型应用场景

ARG03DTC1501的参数特性使其适配多领域应用:

  1. 便携电子设备:手机、平板、智能手表的信号调理电路(如音频滤波、传感器接口);
  2. 工业控制模块:PLC、传感器节点的放大/滤波电路(宽温环境适配);
  3. 可穿戴设备:心率监测、运动传感器的前端分压/限流电路(体积紧凑);
  4. 消费电子:智能家电的控制电路(如温度传感器信号处理);
  5. 汽车电子辅助电路:车载显示屏的信号调节、低功耗控制模块(工作温度覆盖部分车载高温场景)。

六、品牌与可靠性保障

Viking(光颉)作为专业电子元器件制造商,ARG03DTC1501经过严格的可靠性测试验证:

  • 符合RoHS、REACH等环保标准,无有害物质;
  • 经过高温老化、湿度循环、机械振动等测试,确保批量生产一致性;
  • 封装工艺成熟,可兼容回流焊、波峰焊等主流贴片工艺,降低生产难度。

ARG03DTC1501以其精密精度、宽温稳定性与紧凑封装,成为中小功率精密电路的高性价比选择,可满足不同行业对电子组件的性能需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.