Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Viking ARG06BTC1003
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Viking ARG06BTC1003
- Type
- VIKING
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- VIKING
- Electronic Component
- ARG06BTC1003
- Electronic Component
- 1
- Package
- 1206
- Electronic Component
- SMD Resistor
- Electronic Component
- ±0.1%
- Electronic Component
- 0.03g
- Electronic Component
- 100kΩ
- Electronic Component
- 1
- Electronic Component
- BM0263676881
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 200V
- Electronic Component
- ±25ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ARG06BTC1003 产品概述
一、概述
ARG06BTC1003 为 Viking（光颉）系列高精度薄膜贴片电阻，封装尺寸为 1206。采用先进薄膜电阻工艺，专为自动化贴装与波峰/回流焊工艺优化，面向对精度、稳定性和低温漂有较高要求的电子系统设计。标准阻值 100 kΩ，典型用于精密测量与医疗级电子设备中。
二、主要参数
- 电阻类型：薄膜电阻（贴片）
- 阻值：100 kΩ（产品型号末尾“1003”表示 100k）
- 精度：±0.1%（高精度等级）
- 功率：0.25 W（250 mW）
- 工作电压：200 V（最大）
- 温度系数（TCR）：±25 ppm/℃
- 工作温度范围：-55℃ ~ +155℃
- 封装：1206（符合自动插装及标准焊盘设计）
- 阻值范围（系列）：1 Ω ~ 2.49 MΩ
三、性能与优势
- 高稳定性：薄膜工艺保证低噪声、良好的长期稳定性与重复性，适合精密参比与测量回路。
- 优异的温漂特性：±25 ppm/℃ 的低温漂满足高精度温度敏感电路需求。
- 高精度：±0.1% 容差可减少校准频次，提升系统测量可信度。
- 贴片化与自动插装兼容：1206 封装便于高速贴装与标准 SMT 工艺，可靠性高。
- 宽阻值覆盖：系列阻值覆盖从 1 Ω 至 2.49 MΩ，便于在同一系列中选型与替换。
四、典型应用
- 医疗设备：精密测量、传感器前端、校准电路等对稳定性和低温漂要求高的医疗电子。
- 测试与测量仪器：参考电阻、分压网络、模拟前端及高精度数据采集系统。
- 工业控制与数据采集：要求长期稳定与可追溯性的精密场合。
五、封装与安装建议
- 焊接：兼容无铅回流焊工艺，建议遵循通用回流温度曲线并避免超出器件最高工作温度。
- PCB 布局：采用标准 1206 焊盘尺寸，避免过长焊盘以减少热应力；焊盘与阻器两端的铜面应对称，保证良好焊接和热均衡。
- 热管理与降额：在高环境温度下应适当降额使用，确保实际耗散功率在安全范围内；在靠近热源处布线需考虑热传导对器件的影响。
- 机械应力：避免在芯片上施加过大弯曲或机械应力，保证可靠连接与长期稳定性。
六、可靠性与质量保证
Viking（光颉）采用薄膜制程与严格的生产测试流程，出厂经温度循环、老化和阻值筛选，适合医疗与测试设备的高可靠性要求。针对批量采购可提供更多质量记录与检验报告，具体可向供应商咨询。
七、选型与采购提示
完整料号：ARG06BTC1003（品牌：Viking / 光颉，封装：1206，阻值：100 kΩ，精度 ±0.1%）。如需其它阻值或更高/更低功率等级，请参考同系列产品或联系供应商获取样品、交期与技术支持。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
