WMSIC Electronic Components

Viking ARG02BTC4R70

ModelARG02BTC4R70
Package0402
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG02BTC4R70
Type
VIKING
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG02BTC4R70
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.009g
Electronic Component
4.7Ω
Electronic Component
1
Electronic Component
BM0264480949
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Viking ARG02BTC4R70 薄膜贴片电阻产品概述

一、产品核心定位与应用场景

Viking ARG02BTC4R70是一款0402封装精密薄膜贴片电阻,针对低功率、高阻值精度及宽温稳定性需求设计,适配消费电子、工业控制、汽车电子及医疗设备等领域的电路设计。其核心优势在于将高精密性能与小体积封装结合,满足现代电子设备小型化、高性能的双重需求,尤其适合对信号准确性要求苛刻的场景。

二、关键参数与性能指标

参数项 规格值 性能意义 电阻类型 薄膜电阻 比厚膜/碳膜更稳定,低噪声、低温度漂移 标称阻值 4.7Ω 适用于小电流限流、精密分压等基础电路 精度等级 ±0.1% 远高于普通电阻(5%/1%),减少电路误差 温度系数(TC) ±25ppm/℃ 宽温下阻值变化极小,环境适应性强 额定功率 62.5mW(0.0625W) 低功率应用场景,避免大功率下性能衰减 最大工作电压 50V 电气安全边界,超出可能导致击穿 工作温度范围 -55℃~+155℃ 覆盖工业级(-40~85℃)及部分汽车级需求 封装尺寸 0402(1005) 体积小(1.0mm×0.5mm),支持高密度PCB设计

三、技术特点与优势

  1. 高精密性能:±0.1%的阻值精度与±25ppm/℃的温度系数,确保在-55℃~+155℃范围内阻值变化仅约0.0000247Ω,满足传感器信号放大、精密放大器反馈网络等对精度敏感的场景。
  2. 薄膜工艺优势:采用Viking成熟的薄膜沉积工艺,相比厚膜电阻具有更低噪声(典型值<1nV/√Hz),减少信号干扰,提升电路信噪比。
  3. 宽温可靠性:工作温度覆盖极端环境,可适配户外工业传感器、车载低温启动模块等场景,长期运行无明显性能衰减。
  4. 小体积高密度:0402封装适配现代电子设备小型化趋势,可在有限PCB空间内集成更多功能电路(如智能手机主板、智能穿戴设备)。
  5. 批量一致性好:生产工艺确保批量产品的阻值、TC一致性达标,无需额外筛选即可满足量产需求,降低BOM成本与生产周期。

四、典型应用领域

  1. 消费电子:智能手机/平板的音频电路、电源管理模块(小电流限流)、智能穿戴设备的传感器信号调理。
  2. 工业控制:PLC输入输出模块、工业机器人关节传感器、温度/压力变送器的信号放大电路。
  3. 汽车电子:车载信息娱乐系统的信号处理、车身控制模块的低功率控制电路、胎压监测系统(TPMS)的前端调理。
  4. 医疗设备:便携式血糖仪、血压计的信号放大电路、医用监护仪的传感器接口电路(需精度稳定)。
  5. 通信设备:小型基站的射频前端滤波网络、路由器的信号调理电路(低噪声需求)。

五、选型与使用注意事项

  1. 功率降额:建议实际使用功率不超过额定值的70%(≤43.75mW),高温环境下可进一步降额至50%,避免长期过热导致阻值漂移。
  2. 焊接工艺:0402封装需采用精准回流焊工艺,推荐无铅焊接温度曲线(峰值温度≤245℃,回流时间≤60s),避免热应力损伤。
  3. 存储条件:未开封产品建议存储于25℃±5℃、湿度≤60%的环境,存储周期不超过12个月;开封后建议1个月内使用完毕,避免受潮。
  4. 电压限制:严禁超过50V最大工作电压,否则可能引发击穿或绝缘失效。

六、总结

Viking ARG02BTC4R70作为一款高性价比的精密薄膜贴片电阻,以高精密、宽温稳定、小体积为核心竞争力,覆盖多领域低功率精密应用场景。其成熟的工艺与可靠的性能,为电子设计工程师提供了优化电路性能、实现产品小型化的可靠选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.