Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
AR03BTCX2403是Viking(光颉) 推出的精密薄膜贴片电阻,属于光颉被动元件产品线中的高端型号。光颉作为全球知名的被动元件制造商,专注于薄膜电阻、电感等器件的研发与生产,其产品以高稳定性、低噪声、宽温适应性为核心优势,广泛应用于工业控制、医疗设备、通信射频等对精度要求严苛的领域。该型号针对小体积、高精度场景优化,是高密度PCB设计的理想选择。
核心阻值为240kΩ,精度等级达**±0.1%** —— 这一精度远高于普通碳膜电阻(通常±5%~±1%),可满足电桥电路、精密分压网络、传感器校准等需要阻值精准匹配的场景,避免因阻值偏差导致的信号失真或测量误差。
额定功率为100mW(0.1W),适配小信号放大、信号调理、低功耗电源分压等场景(如便携式医疗设备的传感器供电电路)。需注意:实际使用中需结合环境温度(高温下需降额),避免超过功率极限导致器件失效。
温度系数(TCR)为**±25ppm/℃,即温度每变化1℃,阻值变化量不超过:
$$240kΩ \times 25 \times 10^{-6} = 6Ω$$
这一参数体现了器件的宽温稳定性**——即使在极端温度下(如-55℃~+155℃),阻值漂移极小,适合工业现场、车载电子等宽温环境。
相比碳膜、金属膜电阻,薄膜电阻采用真空溅射+光刻工艺制备电阻层,具有三大核心优势:
采用0603封装(英制命名,公制对应1608),具体尺寸为:
小体积设计可显著降低PCB占用面积,适配智能手机、智能穿戴、高密度通信模块等对空间要求严苛的产品。
电阻端接采用镍锡(Sn/Ni)镀层,符合RoHS 2.0环保标准,可兼容回流焊、波峰焊等SMT(表面贴装)工艺,焊接可靠性高,适合批量生产。
AR03BTCX2403的性能特点使其适配以下场景:
综上,AR03BTCX2403凭借高精度、宽温稳定、小体积等核心优势,成为精密电子领域的高性价比选择,尤其适合对阻值精度和环境适应性要求严苛的应用场景。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products