WMSIC Electronic Components

Viking AR03BTCX0150

ModelAR03BTCX0150
Package0603
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking AR03BTCX0150
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
AR03BTCX0150
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.023g
Electronic Component
15Ω
Electronic Component
1
Electronic Component
BM0264911583
Operating Temperature
55℃~+155℃
Electronic Component
±25ppm/℃
Resistor Type
Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Viking光颉AR03BTCX0150贴片薄膜电阻产品概述

Viking光颉AR03BTCX0150是一款专为精密电子电路设计的高精度贴片薄膜电阻,凭借优异的阻值精度、温度稳定性及紧凑封装,成为工业控制、通信设备、仪器仪表等领域的理想被动元件选择。

一、产品核心定位与类别

AR03BTCX0150属于光颉电阻产品线中的高精度薄膜电阻系列,区别于普通碳膜、金属膜电阻,其采用陶瓷基片沉积薄膜工艺制造,核心优势在于低温度系数、高阻值精度及长期稳定性,适用于对电路参数一致性要求严苛的场景。

二、关键电性能参数详解

该电阻的核心电性能参数完全满足精密应用需求:

  1. 阻值与精度:额定阻值15Ω,精度等级±0.1%,属于行业内高精度级别,批量产品的阻值偏差控制在极小范围,可避免电路校准成本;
  2. 功率额定值:100mW(0.1W),适配0603封装的典型功率等级,能满足小电流、低功耗电路的功率需求;
  3. 温度系数(TCR):±25ppm/℃,即每变化1℃,阻值变化仅百万分之25,在宽温环境下阻值漂移极小;
  4. 典型附加性能:薄膜工艺带来低电压系数(<10ppm/V),宽电压范围内阻值稳定性进一步提升,同时具备低噪声特性(典型噪声指数<0.1μV/V),适合音频、信号调理等对噪声敏感的电路。

三、封装与物理特性

  1. 封装类型:采用0603英制封装(对应公制1608),体积紧凑(长1.6mm±0.15mm、宽0.8mm±0.15mm、厚0.45mm±0.05mm),适配高密度PCB布局;
  2. 封装材料:基片为高纯度氧化铝陶瓷,薄膜层采用镍铬合金(NiCr),端电极采用无铅锡镀层(Sn/Cu),符合RoHS、REACH等环保法规要求;
  3. 焊接兼容性:支持回流焊、波峰焊等标准贴片焊接工艺,焊接后无开裂、阻值漂移等问题。

四、工作环境适应性

  1. 工作温度范围:-55℃+155℃,覆盖工业级(-4085℃)及部分高温场景(如车载电子、工业烤箱附近电路);
  2. 存储温度:典型范围-65℃~+150℃,可应对极端存储环境;
  3. 可靠性测试:经过温度循环(-55155℃,1000次)、湿热(85℃/85%RH,1000小时)、振动(102000Hz,加速度2g)等测试,阻值变化率<0.5%,保障长期使用稳定性。

五、典型应用场景

AR03BTCX0150的性能匹配多类精密电路需求:

  • 仪器仪表:万用表、示波器的校准分压电路、精密信号源的反馈网络;
  • 通信设备:基站射频模块的滤波电路、路由器的电源分压电路;
  • 工业控制:PLC的模拟量输入调理电路、传感器信号放大电路;
  • 消费电子:高端音频设备的信号衰减电路、无人机的姿态控制电路;
  • 汽车电子:车载音响的信号处理电路、胎压监测系统的辅助电路(非车载级核心件)。

六、品牌与可靠性背书

Viking光颉作为台湾知名被动元件制造商,拥有30余年电阻生产经验,AR系列产品通过ISO9001质量管理体系认证及IATF16949汽车电子认证(部分型号),批量产品一致性达行业领先水平,可满足大规模量产的品质需求。

总结而言,AR03BTCX0150以高精度、低温度漂移、紧凑封装为核心竞争力,是精密电子领域替代普通电阻的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.