WMSIC Electronic Components

Viking AR03BTCX2701

ModelAR03BTCX2701
Package0603
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking AR03BTCX2701
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
AR03BTCX2701
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.023g
Electronic Component
2.7kΩ
Electronic Component
1
Electronic Component
BM0258839691
Operating Temperature
55℃~+155℃
Electronic Component
±25ppm/℃
Resistor Type
Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Viking光颉AR03BTCX2701贴片薄膜电阻产品概述

Viking光颉AR03BTCX2701是一款专为精密电子电路设计的0603封装贴片薄膜电阻,凭借高精度、低温度漂移及宽工作温度范围,广泛适配工业、汽车、医疗等对稳定性要求严苛的场景。作为台湾光颉科技的核心精密电阻系列产品,其性能参数与可靠性均达到行业领先水平。

一、产品核心规格参数

该型号电阻的关键参数均针对精密应用优化,具体如下:

参数类别 详细指标 备注 电阻类型 薄膜电阻(镍铬系) 真空溅射工艺,膜层均匀性优于厚膜电阻 标称阻值 2.7kΩ(贴片代码2701) 四位代码表示:27×10¹=2700Ω≈2.7kΩ 精度等级 ±0.1%(精密级) 远优于常规碳膜电阻(±1%) 额定功率 100mW(25℃环境下) 小功率但满足多数精密信号电路需求 温度系数(TCR) ±25ppm/℃ 阻值随温度变化的漂移率,低漂移保证稳定 工作温度范围 -55℃~+155℃ 覆盖工业级与汽车级(AEC-Q200可选) 封装形式 0603(英制) 尺寸1.6mm×0.8mm,适合高密度PCB 合规性 RoHS 2.0、REACH、无铅焊接兼容 符合全球环保与焊接工艺标准

二、产品技术特点

该型号的核心优势集中在精度稳定性与环境适应性,具体表现为:

  1. 高精度一致性:±0.1%的精度等级,可减少精密信号调理、计量电路的系统误差,批量应用时阻值偏差极小;
  2. 低温度漂移:±25ppm/℃的TCR意味着,当环境温度变化100℃时,2.7kΩ阻值仅漂移约6.75Ω,远低于普通碳膜电阻(±200ppm/℃);
  3. 宽温可靠性:-55℃~+155℃的工作范围,可适应工业现场的极端温差(如户外传感器、车载电子);
  4. 小体积高密度:0603封装体积仅为常规插件电阻的1/20,适合智能手机、基站模块等高密度PCB设计;
  5. 耐老化性强:薄膜电阻采用真空溅射工艺,膜层与陶瓷基底结合紧密,长期使用阻值变化率≤0.1%(1000小时加速老化);
  6. 环保兼容:无铅焊接工艺兼容,避免传统铅基电阻的环保风险,符合欧盟RoHS指令。

三、典型应用场景

结合参数特性,该电阻主要应用于以下领域:

  1. 工业自动化仪表:温度传感器(PT100)信号放大、压力变送器校准电路,确保测量精度;
  2. 汽车电子:车身控制模块(BCM)的传感器接口、车载信息娱乐系统的信号调理,适应汽车舱内-40℃~+85℃环境;
  3. 医疗仪器:监护仪的生理信号放大、输液泵的流量控制电路,满足医疗设备对稳定、高精度的严苛要求;
  4. 通信设备:基站射频前端的信号衰减、路由器的电源滤波,小封装适配高密度通信模块;
  5. 高端消费电子:专业音频设备的前置放大、电竞显示器的信号处理,提升产品性能一致性。

四、选型与应用注意事项

为确保性能稳定,应用时需注意以下要点:

  1. 功率降额:实际工作功率建议控制在额定值的80%以下(≤80mW),避免过热导致阻值漂移;
  2. 温度漂移评估:若环境温度变化范围超过100℃,需计算TCR带来的阻值变化是否影响电路功能;
  3. 焊接工艺:采用回流焊时遵循IPC-J-STD-020标准,避免过温(峰值温度≤245℃)损坏膜层;
  4. 存储条件:未使用电阻存储在15℃~35℃、湿度40%~60%环境,避免受潮影响焊接性能;
  5. 汽车级认证:若用于汽车领域,需确认型号是否带AEC-Q200认证(光颉部分型号支持)。

Viking光颉AR03BTCX2701以平衡的性能参数与可靠品质,成为精密电子领域的高性价比选择,可有效提升电路稳定性与精度,降低系统设计复杂度。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.