WMSIC Electronic Components

Viking ARG03FTC4701

ModelARG03FTC4701
Package0603
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG03FTC4701
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG03FTC4701
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
4.7kΩ
Electronic Component
1
Electronic Component
BM0263676814
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ARG03FTC4701 薄膜贴片电阻产品概述

一、产品核心定位

ARG03FTC4701是Viking(光颉) 推出的一款0603封装薄膜贴片电阻,属于小功率高精度系列,专为需要稳定阻值、宽温适配性的小型化电子电路设计。其核心定位是平衡“精度、可靠性、体积”三者,满足消费电子、工业控制、汽车电子等领域的中高端应用需求,无需额外校准即可实现稳定的信号传输与电路控制。

二、关键电气性能参数解析

ARG03FTC4701的电气参数围绕“高精度、宽温稳定”设计,核心参数及实际价值如下:

  1. 阻值与精度:标称阻值4.7kΩ(代码标识4701),精度±1%——满足大多数工业级电路对阻值偏差的要求,可避免因阻值漂移导致的信号放大失真、分压误差,尤其适合传感器信号调理、逻辑电平转换等场景;
  2. 功率与电压:额定功率100mW,最大工作电压75V——适配0603封装的典型功率范围,电压裕量充足(远高于常规5V/12V电路的工作电压),可稳定支撑小信号处理电路的长期运行;
  3. 温度系数:±25ppm/℃——薄膜电阻的核心优势,温度变化对阻值的影响极小:例如环境温度从-55℃升至155℃(变化210℃),阻值漂移仅约0.525%,远优于碳膜电阻(通常±500ppm/℃以上),适合温变剧烈的工业/汽车场景;
  4. 工作温度范围:-55℃+155℃——覆盖工业级(-40+85℃)和部分汽车级(-55~+125℃)的温度要求,可在极端环境下(如北方冬季低温、南方夏季高温)长期稳定工作。

三、封装与可靠性设计

  1. 0603封装特性:英制0603(公制1608),尺寸仅1.6mm×0.8mm×0.4mm,体积小、重量轻,适配高密度PCB设计(如智能手机主板、小型工业模块),支持SMT自动化贴装,生产效率提升30%以上;
  2. 薄膜电阻结构优势:采用镍铬薄膜工艺,相比碳膜电阻具有更低的噪声(典型值<0.1μV/√Hz)、更好的高频特性(1GHz以上仍保持稳定)、长期稳定性(阻值漂移率<0.1%/1000小时),适合模拟信号电路与高频通信电路;
  3. 可靠性验证:符合RoHS环保标准,通过振动(10~2000Hz,1g)、冲击(1000m/s²)等可靠性测试,可在工业粉尘、汽车振动等恶劣环境下运行,故障间隔时间(MTBF)超10^6小时。

四、典型应用场景

ARG03FTC4701的参数适配性使其覆盖多领域应用:

  1. 消费电子:智能手机、智能穿戴设备的信号调理电路(如加速度传感器接口、音频前置放大),利用小体积实现紧凑设计;
  2. 工业控制:PLC的I/O模块、温度传感器信号放大电路,宽温范围满足工厂车间(-20~+60℃)的温度变化;
  3. 汽车电子:车身控制模块(BCM)的车门传感器电路、灯光控制电路,-55~+155℃的温度范围适配汽车发动机舱外的环境;
  4. 通信设备:路由器、基站的滤波器、衰减器电路,薄膜电阻的高频特性确保信号传输无失真。

五、品牌与品质背书

Viking(光颉)作为全球知名电阻制造商,拥有20余年薄膜电阻生产经验,ARG03FTC4701的批量生产一致性好(阻值偏差控制在±0.5%以内),符合IEC 61000-4-2(ESD)、IEC 61000-4-3(EMI)等国际标准,广泛应用于华为、小米、博世等客户的中高端产品中,品质可靠性得到市场验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.