WMSIC Electronic Components

Viking CSR0204FTDV2002

ModelCSR0204FTDV2002
PackageMELF-0204
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking CSR0204FTDV2002
Type
VIKING
Minimum package
3000 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
CSR0204FTDV2002
Electronic Component
1
Package
MELF-0204
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.039g
Electronic Component
20kΩ
Electronic Component
1
Electronic Component
BM0264911649
Operating Temperature
55℃~+155℃
Operating Voltage
200V
Electronic Component
±50ppm/℃
Resistor Type
Metal Film Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CSR0204FTDV2002 — Viking(光颉) MELF 金属膜电阻产品概述

一、核心参数与型号说明

CSR0204FTDV2002 为 Viking(光颉) 系列金属膜 MELF 电阻,基础电气参数如下:

  • 阻值:20 kΩ
  • 精度:±1%(系列可提供严苛公差至 ±0.1%)
  • 额定功率:250 mW(MELF-0204 封装)
  • 最高工作电压:200 V
  • 温度系数:±50 ppm/°C(可选更低至 ±10 ppm/°C)
  • 工作温度范围:-55℃ ~ +155℃
  • 封装:MELF-0204(玻璃封装圆柱体,适合自动贴装与波峰/回流焊)

二、结构与关键特性

该器件采用金属薄膜电阻工艺,结合 MELF 玻璃封装,具有:

  • 出色的整体稳定性与长期漂移小
  • 极低的热噪声与良好频率特性(低寄生电感、电容)
  • 良好的抗机械冲击与高温循环可靠性
  • 可提供高精度与低温漂选项,满足精密测量与校准场景

三、电气性能与可靠性建议

CSR0204FTDV2002 在额定环境条件下提供稳定的阻值与温度性能。为了保证长期可靠性,建议在寄生发热与环境温度较高时参考厂方降额曲线进行功率降额使用;并避免在长期高于额定温度区间工作的工况。对于高稳定性要求的设计,可选用低 TCR(±10 ppm/°C)与更高功率等级的同系列型号。

四、典型应用场景

  • 电信设备:电平校准、阻抗匹配、精密分压
  • 医疗设备:传感器前端、参考电路、滤波与采样网络
  • 精密仪表与数据采集:低噪声信号链、温度补偿电路
  • 航空航天与工业控制:对长期漂移与环境适应性有要求的电路

五、安装与使用注意事项

  • MELF 结构对焊接热循环敏感,遵循厂商推荐的回流或波峰焊温度曲线,避免超时高温暴露。
  • 焊接后应避免剧烈机械弯曲或冲击,使用自动贴装时注意机构对中。
  • 清洗时选用对玻璃及端帽安全的溶剂,避免腐蚀性化学品长期接触。
  • 若电路中存在较大瞬态电压或浪涌,请评估峰值能量与电阻额定电压是否匹配并必要时增加限流/保护元件。

六、选型与替代建议

CSR0204FTDV2002 适用于对小尺寸、高稳定性有要求的设计;若需更高精度或更低 TCR,可在 Viking 系列中选择 ±0.1%/±10 ppm/°C 型号;若需更高功率,则可考虑更大封装或特殊金属膜功率型件。最终选型请参考最新产品数据手册和可靠性测试报告,以确保满足具体环境与法规要求。

总结:CSR0204FTDV2002 将 MELF 封装的低噪声、低寄生与金属膜的高稳定性结合,适合电信、医疗与精密测量等需要长期稳定与高可靠性的场合。有关物料表(BOM)替换、详细热特性与焊接工艺,请联系 Viking(光颉) 或参阅官方技术资料。

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