WMSIC Electronic Components

Viking ARG06FTC0470

ModelARG06FTC0470
Package1206
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG06FTC0470
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG06FTC0470
Electronic Component
1
Package
1206
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.03g
Electronic Component
47Ω
Electronic Component
1
Electronic Component
BM0265378713
Operating Temperature
55℃~+155℃
Operating Voltage
200V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Viking光颉ARG06FTC0470薄膜电阻产品概述

一、产品核心定位

ARG06FTC0470是光颉(Viking)推出的1206封装高精度薄膜电阻,针对中低压精密电路设计,兼顾小型化、高稳定性与宽温适应性,适配工业控制、汽车电子、通信设备等对阻值精度和环境耐受性要求较高的场景,是替代普通碳膜/金属膜电阻、提升电路可靠性的优选型号。

二、关键电气参数详解

该电阻的核心参数围绕「精度、稳定性、环境适应性」展开,具体如下:

  • 阻值与精度:标称阻值47Ω,精度±1%,满足绝大多数精密信号调理、分压电路的校准需求,无需额外调试即可实现稳定输出;
  • 功率与电压:额定功率250mW,工作电压200V,功率密度适配1206小型封装,可在紧凑PCB布局中稳定承载中低压负载;
  • 温度特性:温度系数(TC)±25ppm/℃,远优于普通碳膜电阻(典型±200ppm/℃),温度变化时阻值漂移极小;工作温度范围-55℃~+155℃,覆盖工业、汽车等恶劣环境的温度波动;
  • 长期稳定性:薄膜电阻结构的固有优势使其长期漂移率低于0.1%/1000小时,适合长期连续运行的设备(如24小时在线的工业控制器)。

三、封装与物理特性

采用1206英制封装(对应公制3216,尺寸3.2mm×1.6mm),体积紧凑,适合高密度PCB设计;基片为高导热氧化铝陶瓷,可快速散发热量,避免局部过热;薄膜层采用镍铬合金(NiCr),兼具低温度系数与高稳定性,表面覆盖耐温环氧树脂涂层,提升抗潮湿、抗机械损伤能力。

四、性能优势与典型应用

4.1 核心性能优势

  • 高精度低漂移:±1%精度+±25ppm/℃温度系数,确保电路在宽温范围内阻值稳定,避免信号失真(如医疗监护仪的心率信号调理);
  • 宽温可靠:-55℃~+155℃工作范围,通过汽车级温度循环测试(部分型号符合AEC-Q200),适配极端环境(如北方冬季户外工业设备);
  • 低噪声特性:薄膜结构的电流噪声系数远低于碳膜电阻,适合音频、医疗信号处理等对噪声敏感的场景;
  • 高功率密度:250mW功率适配1206封装,无需牺牲体积即可满足中功率需求(如通信基站的射频衰减器)。

4.2 典型应用场景

  • 工业控制:PLC输入输出模块、传感器信号调理(温度/压力传感器的分压/限流);
  • 汽车电子:车载ECU、胎压监测/氧传感器的信号处理电路;
  • 通信设备:基站射频衰减器、路由器电源管理模块的分压电阻;
  • 医疗设备:监护仪的血氧/心率信号调理、诊断仪器的精密测量电路;
  • 消费电子:高端音频设备的信号衰减、笔记本电脑的电源反馈电路。

五、可靠性与使用注意事项

5.1 质量认证

光颉作为全球被动元件厂商,ARG06FTC系列符合RoHS、REACH环保标准,部分型号通过AEC-Q200汽车级认证;产品经过负载寿命测试(1000小时@85℃/85%RH)、温度循环测试(-55℃~+155℃循环1000次),失效概率低于100ppm。

5.2 使用注意事项

  • 功率降额:实际使用功率建议不超过额定功率的80%(≤200mW),延长产品寿命;
  • 焊接温度:回流焊峰值温度≤245℃,焊接时间≤30秒,避免过热损坏薄膜层;
  • 存储条件:常温干燥环境(25℃±5℃,湿度40%~60%),避免长期暴露于潮湿环境;
  • 电压限制:不得超过200V工作电压,防止绝缘击穿。

六、总结

ARG06FTC0470以小型化、高精度、宽温稳定为核心特点,覆盖工业、汽车、通信等多领域的精密电路需求,是提升电路可靠性与稳定性的理想选择,尤其适合对阻值漂移敏感、环境温度波动大的应用场景。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.