Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Viking ARG03FTC6491
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Viking ARG03FTC6491
- Type
- VIKING
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- VIKING
- Electronic Component
- ARG03FTC6491
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.023g
- Electronic Component
- 6.49kΩ
- Electronic Component
- 1
- Electronic Component
- BM0264911579
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 75V
- Electronic Component
- ±25ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ARG03FTC6491 贴片薄膜电阻产品概述
一、核心参数概览
ARG03FTC6491是一款0603封装贴片薄膜电阻，核心参数精准匹配精密电路需求：
- 阻值与精度：额定阻值6.49kΩ，精度控制在±1%，属于E96系列精密阻值，可满足信号传输、分压限流等场景的稳定需求；
- 功率与电压：额定功率100mW，额定工作电压75V，高于同功率级0603封装厚膜电阻的典型电压（通常50V），覆盖更多电路电压场景；
- 温度特性：温度系数（TC）±25ppm/℃，即温度每变化1℃，阻值变化仅0.025%，远低于厚膜电阻的典型TC值；工作温度范围-55℃~+155℃，可适应极端环境；
- 封装：英制0603封装（公制1608，尺寸1.6mm×0.8mm），适合高密度PCB集成。
二、产品核心特性
作为薄膜电阻，ARG03FTC6491具备三大关键优势：
- 低噪声与高稳定性：薄膜工艺（溅射成膜）相比厚膜电阻，噪声更低（典型值<10nV/√Hz），膜层附着力强，长期阻值漂移小（老化测试后阻值变化<0.1%/1000h）；
- 宽温与可靠性：-55℃~+155℃的宽温范围，无需额外降额设计即可满足工业级应用；额定电压75V，可避免高压下的击穿风险；
- 小封装高密度：0603封装可节省约40%的PCB空间，适合可穿戴设备、小型通信模块等对尺寸敏感的场景，支持自动化贴装（贴装精度±0.1mm）。
三、典型应用场景
ARG03FTC6491的参数特性使其覆盖多领域需求：
- 精密测量电路：压力/温度传感器的信号调理、数据采集卡的分压网络，依赖其±1%精度与低TC确保测量误差<0.5%；
- 通信设备：基站射频模块的阻抗匹配、路由器的信号滤波电路，小封装支持高密度PCB设计；
- 工业控制：PLC、变频器的控制回路电阻，宽温范围适应车间-20℃~+60℃的温度波动；
- 消费电子：智能手机的电源管理（电压检测电阻）、智能手表的音频放大器反馈电阻，低噪声提升音质纯度；
- 汽车电子辅助电路：车载显示屏背光控制、胎压传感器信号处理（若需车规级则需进一步认证，但宽温已满足基础需求）。
四、封装与品质保障
- 封装设计：0603封装采用陶瓷基板，散热性能优异（热阻约150℃/W），额定功率下工作时表面温度<85℃，避免过热老化；
- 品牌背书：由Viking（光颉）电子生产，光颉是全球精密电阻龙头，产品符合RoHS 2.0、REACH环保标准，经过温度循环（-55~155℃×1000次）、湿度测试（85℃/85%RH×1000h）等可靠性验证；
- 品质控制：生产过程采用自动阻值分选，确保每只电阻的精度与TC符合规格，不良率<0.1%。
ARG03FTC6491凭借薄膜电阻的稳定性、小封装的灵活性，成为精密电子设备中替代厚膜电阻的优选方案，可满足从消费电子到工业控制的多样化需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
