WMSIC Electronic Components

Viking ARG05FTC5601

ModelARG05FTC5601
Package0805
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG05FTC5601
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG05FTC5601
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.029g
Electronic Component
5.6kΩ
Electronic Component
1
Electronic Component
BM0264911569
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ARG05FTC5601薄膜贴片电阻产品概述

一、产品基础定位与核心参数

ARG05FTC5601是光颉(Viking)品牌推出的0805封装精密薄膜贴片电阻,针对工业级及消费电子领域的稳定信号处理、电源调节等场景设计。其核心参数明确:

  • 标称阻值:5.6kΩ(电子电路常用标准化阻值)
  • 精度等级:±1%(满足多数精密电路的阻值偏差要求)
  • 额定功率:125mW(适配0805封装的典型功率等级)
  • 最大工作电压:150V(同功率同封装产品中电压性能较优)
  • 温度系数:±25ppm/℃(薄膜电阻的典型稳定系数)
  • 工作温度范围:-55℃至+155℃(宽温环境适应性强)

二、核心性能指标深度解析

1. 阻值与精度

标称阻值5.6kΩ是模拟电路、电源分压等场景的高频使用阻值,±1%的精度可避免因阻值偏差导致的信号失真(如滤波截止频率偏移)或功率损耗异常,无需额外校准即可满足常规精密设计需求。

2. 功率与电压

额定功率125mW符合0805封装贴片电阻的常规功率等级,最大工作电压150V(计算得最大工作电流≈26.8mA),可适配中等电压的电源限流、分压电路,无需因电压限制降额使用。

3. 温度特性

±25ppm/℃的温度系数是薄膜电阻的核心优势:当环境温度变化1℃时,阻值仅变化0.14Ω(5.6kΩ×25ppm),远小于碳膜电阻(通常±200ppm/℃以上)。配合-55℃至+155℃的宽温范围,可稳定工作于工业现场、汽车舱内等极端温度环境。

三、封装特性与工艺优势

ARG05FTC5601采用0805英制贴片封装(公制尺寸2.0mm×1.25mm),体积小巧,适配高密度PCB设计,可有效节省电路板空间(如便携式医疗仪器、智能穿戴设备)。其薄膜电阻制作采用真空溅射工艺,相比厚膜电阻(丝网印刷),阻值一致性更好、噪声更低(典型值<10nV/√Hz)、长期稳定性更高(1000小时老化阻值变化<0.1%),尤其适合对信号质量要求较高的模拟电路。

四、品牌可靠性与合规性

光颉(Viking)作为专业电阻制造商,ARG05FTC5601经过多项可靠性验证:

  • 高温老化测试:155℃下连续工作1000小时,阻值变化率<0.1%;
  • 湿度循环测试:85℃/85%RH环境下循环100次,性能无衰减;
  • 机械应力测试:通过振动(10-2000Hz,1g)、冲击(100g,1ms)测试,适配移动设备场景。

同时,产品符合RoHS 2.0、REACH等环保指令,无铅无镉,满足全球市场合规要求。

五、典型应用场景

ARG05FTC5601的性能特点使其适配多个领域:

  • 工业控制:PLC输入输出模块的信号分压、传感器接口限流(宽温适配工业现场高低温);
  • 消费电子:小型电源适配器电压反馈网络、智能音箱信号滤波(小体积适配便携设备);
  • 汽车电子:辅助驾驶传感器信号调理(宽温+稳定温系适配舱内温度变化);
  • 医疗设备:便携式监护仪生理信号放大(低噪声+稳定阻值保障信号精度);
  • 通信设备:射频前端滤波匹配网络(薄膜电阻低噪声优势提升信号质量)。

综上,ARG05FTC5601以高稳定性、宽温适应性及小体积优势,成为工业、消费、汽车等领域精密电路设计的可靠选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.