WMSIC Electronic Components

Viking ARG06BTC2493

ModelARG06BTC2493
Package1206
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking ARG06BTC2493
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
ARG06BTC2493
Electronic Component
1
Package
1206
Electronic Component
SMD Resistor
Electronic Component
±0.1%
Electronic Component
0.03g
Electronic Component
249kΩ
Electronic Component
1
Electronic Component
BM0265817337
Operating Temperature
55℃~+155℃
Operating Voltage
200V
Electronic Component
±25ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ARG06BTC2493薄膜贴片电阻产品概述

ARG06BTC2493是Viking(光颉) 推出的高精度薄膜贴片电阻,采用1206封装,针对需要稳定阻值、低温度漂移的精密电子场景设计,兼具宽温适应性与功率可靠性,是工业级与高端消费电子领域的常用选型。

一、产品核心定位与设计目标

该电阻以高精度、宽温稳定为核心设计目标,针对普通贴片电阻无法满足的精密电路需求——如分压精度要求高、温度变化对阻值影响敏感的场景。相比普通碳膜电阻(精度±5%、温度系数±200ppm/℃以上),ARG06BTC2493在精度、温度稳定性上实现显著提升,同时保持贴片封装的小型化优势,适配自动化贴装产线。

二、关键参数规格解析

ARG06BTC2493的核心参数严格匹配精密电路需求,具体如下:

  • 阻值与精度:标称阻值249kΩ,精度±0.1%,可满足多数精密分压、限流电路的误差要求(如万用表分压网络的误差控制);
  • 功率与电压:额定功率250mW,最大工作电压200V,满足中等功率密度的电路需求(如小型DC-DC转换器的反馈电阻);
  • 温度系数:±25ppm/℃,即温度每变化1℃,阻值漂移不超过249kΩ×25×10⁻⁶=6.225mΩ,宽温环境下阻值稳定性优异;
  • 工作温度范围:-55℃~+155℃,覆盖工业级环境温度(如户外基站、高温工业设备),无需额外降额即可稳定工作;
  • 封装:1206(英制规格,对应公制3216),贴片式无引脚结构,尺寸为3.2mm×1.6mm×0.5mm(典型值),适配SMT贴装工艺。

三、封装与物理特性

ARG06BTC2493采用1206标准贴片封装,具备以下物理特性:

  • 小型化设计:体积紧凑,可有效节省PCB空间,适合高密度电路布局(如通信设备的射频前端模块);
  • 无引脚结构:表面贴装式设计,避免传统插件电阻的引脚寄生参数,提升高频电路性能;
  • 环保合规:符合RoHS 2.0、REACH等环保标准,不含铅、镉等有害物质,适配全球市场需求;
  • 机械强度:封装材料采用耐高温环氧树脂,可承受回流焊高温(峰值260℃左右),贴装后机械稳定性可靠。

四、性能优势与可靠性

ARG06BTC2493的薄膜电阻技术赋予其显著的性能优势:

  • 低噪声特性:薄膜电阻的噪声系数远低于碳膜、金属膜电阻,适合音频、射频等对噪声敏感的电路;
  • 长期稳定性:薄膜电阻的阻值老化率低(典型值<0.05%/1000小时),长期使用后仍能保持精度;
  • 功率降额优势:额定功率250mW,按50%降额(实际功耗≤125mW)使用时,寿命可延长至10万小时以上,满足工业设备长周期运行需求;
  • 宽温适应性:-55℃~+155℃的工作范围,可覆盖从寒冷地区户外设备到高温工业烤箱内的电路应用。

五、典型应用领域

ARG06BTC2493因精度高、稳定性好,广泛应用于以下场景:

  • 精密测量仪器:示波器、数字万用表的分压网络、信号衰减电路;
  • 通信设备:基站射频模块的信号调理、路由器的电源反馈电路;
  • 工业控制:PLC(可编程逻辑控制器)的模拟量输入电路、传感器信号放大电路;
  • 电源模块:DC-DC转换器、线性稳压器的反馈电阻、电流采样电阻;
  • 高端消费电子:Hi-Fi音频设备的偏置电路、智能穿戴设备的传感器校准电路。

综上,ARG06BTC2493薄膜贴片电阻通过高精度、宽温稳定、小型化等特性,成为精密电子领域的可靠选型,适配多种工业与消费电子场景的需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.