WMSIC Electronic Components

Viking AR05DTBW2001

ModelAR05DTBW2001
Package0805
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Viking AR05DTBW2001
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
AR05DTBW2001
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±0.5%
Electronic Component
0.029g
Electronic Component
2kΩ
Electronic Component
1
Electronic Component
BM0265817416
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±10ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AR05DTBW2001薄膜贴片电阻产品概述

一、产品基本信息

AR05DTBW2001是Viking(光颉) 推出的一款0805封装薄膜贴片电阻,属于高精度小功率电阻范畴。其核心参数清晰:标称阻值2kΩ,精度±0.5%,额定功率125mW,最大工作电压150V,温度系数±10ppm/℃,工作温度范围覆盖-55℃至+155℃,适配多数工业及消费电子场景的宽温需求。

二、核心性能参数解析

2.1 阻值与精度

该电阻标称阻值为2001(即2kΩ),精度±0.5%——远高于普通碳膜电阻(通常±1%~±5%)。实际应用中,其阻值偏差最大不超过10Ω(2kΩ×0.5%),能满足信号分压、基准电压电路等对参数一致性要求极高的设计。

2.2 功率与电压能力

额定功率125mW是0805封装电阻的典型功率等级,适配低功耗电路;最大工作电压150V,可支持5V、12V、24V等常见低压系统,避免电压击穿风险,覆盖多数民用/工业电路场景。

2.3 温度稳定性

温度系数(TCR)±10ppm/℃是核心优势:当环境温度变化100℃时,阻值漂移仅±1Ω(2kΩ×10ppm×100℃),远低于普通电阻(通常±50ppm/℃以上)。这一特性使其在户外设备、汽车舱内等宽温环境中仍能保持电路参数稳定。

2.4 封装尺寸

采用0805英制封装(对应公制2012,尺寸约2.0mm×1.2mm),体积小巧,可大幅节省PCB布局空间,适配智能手机、智能穿戴等小型化产品。

三、典型应用场景

3.1 消费电子信号调理

在手机音频电路、平板传感器信号放大模块中,需高精度电阻减少信号失真。AR05DTBW2001的±0.5%精度及低噪声薄膜特性,可有效抑制背景干扰,提升音频/传感信号质量。

3.2 工业控制模拟电路

工业PLC的模拟量输入模块、传感器信号采集电路对阻值稳定性要求苛刻。其-55℃~+155℃的宽温范围及±10ppm/℃的TCR,能适应车间高低温环境,避免参数漂移导致的误判。

3.3 通信设备滤波电路

基站、路由器的滤波网络需电阻与电容配合实现信号筛选。该电阻的小体积(0805)及稳定阻值,可提升滤波电路的集成度与一致性,减少批量生产中的参数波动。

3.4 汽车电子辅助电路

汽车仪表盘背光控制、传感器信号处理电路需应对极端温度(冬季-40℃、夏季+85℃)。AR05DTBW2001的宽温范围及AEC-Q200(汽车级)认证,确保长期可靠运行。

四、品牌与封装优势

4.1 品牌可靠性

Viking(光颉)专注薄膜电阻研发20余年,产品通过ISO9001、AEC-Q200等认证,一致性及可靠性优于行业平均水平——批量生产中,阻值偏差控制在±0.3%以内(远低于标称±0.5%)。

4.2 封装适配性

0805封装支持自动化贴装(SMT),生产效率高;焊盘设计符合IPC标准,可减少虚焊风险,提升产品良率。此外,该封装兼容多数PCB设计软件的封装库,降低设计门槛。

五、环境适应性与长期稳定性

除宽温范围外,AR05DTBW2001的金属膜沉积工艺使其具有低噪声、低漂移特点:1000小时老化测试后,阻值变化率小于0.1%,适合医疗仪器、计量设备等对长期稳定性要求极高的场景。

综上,AR05DTBW2001以高精度、宽温稳定、小体积等特点,成为消费电子、工业控制、通信等领域的高性价比贴片电阻选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.