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Viking ARG05FTC5602
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Viking ARG05FTC5602
- Type
- VIKING
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 125mW
- Electronic Component
- Electronic Component
- Electronic Component
- VIKING
- Electronic Component
- ARG05FTC5602
- Electronic Component
- 1
- Package
- 0805
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.029g
- Electronic Component
- 56kΩ
- Electronic Component
- 1
- Electronic Component
- BM0264911661
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 150V
- Electronic Component
- ±25ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ARG05FTC5602 产品概述
一、产品简介
ARG05FTC5602 是 Viking(光颉) 系列的贴片薄膜电阻，封装为 0805（约 2.0 × 1.25 mm），标称阻值 56 kΩ，精度 ±1%，额定功率 125 mW。该器件采用薄膜工艺制备，具有低温度系数、良好的长期稳定性与低噪声特性，适用于对精度和长期可靠性有较高要求的贴片电路设计。
二、主要参数
- 阻值：56 kΩ
- 精度：±1%（常温标称）
- 额定功率：125 mW（参考环境温度下）
- 最高工作电压：150 V（DC）
- 温度系数（TCR）：±25 ppm/℃
- 工作温度范围：-55 ℃ ~ +155 ℃
- 封装：0805（贴片）
- 工艺类型：薄膜电阻
- 品牌：Viking(光颉)
三、性能特点
- 高精度：±1% 阻值公差满足多数精密电阻网络和分压应用的需求。
- 低温漂：±25 ppm/℃ 的 TCR 在温度变化环境下保持较好阻值稳定性，适合测量与信号调理电路。
- 良好频率特性与低噪声：薄膜制造工艺使得噪声系数较金属膜或碳膜电阻更低，适合高阻值、低噪声应用。
- 小体积、高密度：0805 尺寸兼顾占板面积与功率承受能力，适用于紧凑型 PCB 设计。
- 宽温度范围：-55 ℃ 到 +155 ℃ 的工作温度覆盖工业级应用场景。
四、典型应用场景
- 精密分压器、参考电路与偏置网络
- 传感器信号调理、放大器反馈回路
- 通信设备与滤波电路中的阻抗匹配与衰减器
- 工业控制、数据采集与测试测量仪器
- 消费类与便携设备中要求稳定性的阻值元件
五、使用与布板建议
- 布局：0805 尺寸适合密集布线，但在高功耗或热敏元件相邻时应预留散热间距，避免热叠加。
- 降额：在高环境温度下须对额定功率进行降额处理。建议参考厂商的功率-温度降额曲线，常见做法为超过某一基准温度后线性降额直至最大允许温度。
- 回流焊：该类贴片电阻适配主流回流焊工艺。为保证可靠焊接，建议按生产商提供的回流温度曲线与时间窗进行。
- 封装与盘带：适用于卷带（Reel）包装，便于 SMT 贴装生产线自动化使用。
六、可靠性与检验
- 长期稳定性：薄膜工艺在长期使用中表现出较小的阻值漂移，适合对长期精度敏感的电路。
- 环境适应性：在规定的工作温度范围内能保持性能稳定，满足工业级温度循环需求。
- 建议在设计验证阶段进行温度循环、湿热与焊接应力测试，以验证在目标应用中的实装可靠性。
七、选型与替代注意事项
- 若电路对功率或工作电压有更高要求，可考虑更大封装或更高功率等级的薄膜/合金电阻。
- 对于更高精度或更低 TCR 的应用，可选用 0.5% 或更高等级精度及更低 ppm/℃ 的型号。
- 在等效替代时，需同时匹配阻值、功率、TCR、最大工作电压和封装尺寸，避免仅以阻值和精度替代。
如需进一步的封装尺寸图、回流焊工艺曲线或生命周期测试报告，可提供具体需求，以便获取更详细的技术资料与器件样品支持。
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