WMSIC Electronic Components

Viking AR03BTBX1503

ModelAR03BTBX1503
Package0603
BrandVIKING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
Viking AR03BTBX1503
Type
VIKING
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
VIKING
Electronic Component
AR03BTBX1503
Electronic Component
1
Package
0603
Electronic Component
0.023g
Electronic Component
1
Electronic Component
BM0265966192
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AR03BTBX1503薄膜贴片电阻产品概述

一、产品核心定位与品牌背景

AR03BTBX1503是台湾光颉(Viking)电子推出的工业级高精度薄膜贴片电阻,属于其“BTBX系列”核心型号。光颉作为专注被动元件研发制造的厂商,以“真空镀膜工艺+低漂移设计”为技术核心,该系列电阻针对对阻值精度、温度稳定性要求严苛的场景(如精密仪器、工业控制)定向开发,AR03BTBX1503是150kΩ阻值的典型应用型号。

二、关键性能参数详解

该电阻的核心参数围绕“高精度、高稳定性”展开,具体覆盖终端应用的核心需求:

  • 阻值与精度:标称150kΩ,精度±0.1%(行业常规贴片电阻多为±1%~±5%),可直接用于精密分压、电流采样等对误差敏感的电路,无需额外校准;
  • 温度系数(TCR):±10ppm/℃,即温度每变化1℃,阻值变化0.001%。以工作温区(-55℃~+155℃)计算,最大温差210℃时,总阻值变化仅±0.21%,远优于厚膜电阻(通常±50ppm/℃以上);
  • 功率额定值:100mW(0.1W),符合0603封装贴片电阻的常规功率规格,实际使用建议降额至80%(80mW),高温场景需进一步降额;
  • 工作温度范围:-55℃+155℃,覆盖工业级(-40℃+85℃)及部分汽车级高温场景(如发动机舱周边),极端环境下性能无明显衰减。

三、封装与尺寸规格

AR03BTBX1503采用0603贴片封装(英制0.06"×0.03",公制1.6mm×0.8mm),具有以下适配性优势:

  • 小体积高密度:适合便携式医疗设备、小型通信模块等对PCB空间要求严格的产品;
  • 焊接兼容性:支持回流焊、波峰焊等常规工艺,焊接过程无引脚变形风险;
  • 封装密封性:陶瓷基片+薄膜镀层结构,抗潮湿、抗机械应力性能优于插件电阻,可通过IPC-A-610E可靠性标准。

四、典型应用场景分析

基于其高精度、宽温区特性,该电阻主要应用于以下领域:

  1. 精密医疗仪器:血压计压力传感器信号调理、血糖监测仪电流采样,稳定阻值避免读数误差;
  2. 工业控制模块:PLC模拟量输入通道、高温环境温度传感器放大电路,宽温区确保极端工况下性能稳定;
  3. 通信设备:基站射频前端信号衰减、路由器电源监控,高精度阻值提升信号传输准确性;
  4. 汽车电子辅助系统:胎压监测(TPMS)信号处理、座椅加热控制,155℃上限兼容部分高温场景;
  5. 测试测量仪器:示波器垂直放大器校准、万用表分压网络,长期稳定性延长仪器校准周期。

五、可靠性与环境适应性

该电阻的可靠性源于薄膜工艺及封装设计:

  • 薄膜工艺优势:真空溅射镀膜使阻值分布均匀,抗老化性能优于碳膜/厚膜,长期使用阻值漂移≤0.1%;
  • 温度循环稳定性:经-55℃~+155℃循环测试(1000次),阻值变化率≤0.1%,满足工业级长期可靠性要求;
  • 耐湿性:符合IEC 60068-2-67湿热标准,85℃/85%RH环境下放置1000小时,阻值变化≤0.2%;
  • 抗电涌能力:低寄生电感特性,可抵抗短时间脉冲电涌(如电源瞬态电压),适合脉冲电路应用。

六、选型与应用注意事项

使用时需注意以下要点,避免性能衰减:

  1. 功率降额:>125℃环境下,功率需降额至50mW,避免薄膜层过热损坏;
  2. 焊接工艺:回流焊峰值温度≤245℃(时间≤10秒),符合J-STD-020标准;
  3. 存储条件:25℃±5℃、湿度≤60%环境存储,开封后12个月内使用;
  4. 电路匹配:与高精度运放(如OPA2134)、AD转换器(如ADS1256)搭配,最大化发挥精度优势。

该型号凭借“高精度、宽温区、小封装”的综合优势,成为工业控制、医疗仪器等领域的优选电阻,可有效提升终端产品的性能稳定性与可靠性。

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