Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
VBsemi BSS308PE-VB BSS308PE
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- VBsemi BSS308PE-VB
- Type
- VBSEMI
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- VBSEMI
- Electronic Component
- BSS308PE-VB
- Electronic Component
- 1
- Package
- SOT-23(TO-236)
- Electronic Component
- 1 P
- Type
- P
- Electronic Component
- MOSFET
- Electronic Component
- 0.047g
- Electronic Component
- 1
- Electronic Component
- BM0228586621
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 2.5W
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 30V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BSS308PE-VB 产品概述
一、概述
BSS308PE-VB 是微碧半导体（VBsemi）推出的一款 P 沟道MOS场效应管，采用 SOT-23（TO-236）小封装，面向便携设备与小功率电源管理场景。该器件在低压、高效能开关和高侧开关应用中表现优良，适合空间受限且需控制功耗的电路设计。
二、主要电气参数
- 漏源耐压 Vdss：30 V
- 连续漏极电流 Id：5.6 A（封装与环境依赖）
- 导通电阻 RDS(on)：46 mΩ @ VGS=10 V, ID=4.4 A
- 阈值电压 VGS(th)：约 2 V
- 耗散功率 Pd：2.5 W（SOT-23 封装，热设计需注意）
- 总栅极电荷 Qg：24 nC @ 10 V（影响开关损耗）
- 输入电容 Ciss：1.295 nF @ 15 V
- 输出电容 Coss：150 pF
- 反向传输电容 Crss：130 pF
- 工作结温范围 Tj：-55 ℃ ～ +150 ℃
以上参数体现了器件在静态导通损耗与动态开关性能之间的平衡，适合中等电流、较高频率的功率切换。
三、典型应用场景
- 电池供电设备的高侧开关与电源路径管理
- 便携式消费电子的负载开关与省电控制
- 反向极性保护与电源切换（需配合适当电路）
- DC-DC 变换器中作为同步开关或辅助开关（考虑驱动方式与损耗）
四、设计与使用建议
- 驱动建议：作为 P 沟道器件，栅极相对源极需施加负向驱动以完全导通（例如将栅极拉低接地以开通连接到正电源的高侧）。在驱动电压接近规定值（10 V）时可达到标称 RDS(on) 性能。
- 开关损耗：Qg 为 24 nC 和较大的 Ciss 表明在高频切换时栅极驱动能量与开关损耗不可忽视，应选择足够驱动能力的驱动电路或限频使用。
- 热管理：封装 Pd=2.5 W 在实际 PCB 上受铜箔面积与散热条件限制，长时间大电流工作时需增大铜箔或采用并联/降额设计以避免过热。
- 电路保护：建议在实际应用中加入软启动、限流或瞬态抑制元件，避免电压尖峰和击穿风险。
五、小结
BSS308PE-VB 在 SOT-23 小封装下提供了较低的导通阻抗和适中的开关特性，适合对体积和效率有要求的低压电源管理场景。设计时需重视栅极驱动、电磁兼容与热布线，以发挥其最佳性能。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
