WMSIC Electronic Components

Chinocera HGC1206R5226M250NSPJ

ModelHGC1206R5226M250NSPJ
Package1206
BrandCHINOCERA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
Chinocera HGC1206R5226M250NSPJ
Type
CHINOCERA
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CHINOCERA
Electronic Component
HGC1206R5226M250NSPJ
Electronic Component
1
Electronic Component
22uF
Package
1206
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±20%
Electronic Component
0.075g
Electronic Component
1
Electronic Component
BM0265804845
Electronic Component
X5R
Voltage
25V
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HGC1206R5226M250NSPJ多层陶瓷电容产品概述

一、核心参数与型号解读

该型号为华瓷(Chinocera)推出的通用型多层陶瓷电容(MLCC),型号各部分含义清晰:

  • HGC:华瓷MLCC主力系列标识,主打高可靠性与成本平衡;
  • 1206:封装尺寸(英制0.12in×0.06in,公制3.2mm×1.6mm);
  • 226:容值编码(22×10⁶ pF=22μF),遵循行业通用规则;
  • M:精度等级(±20%),适配非高精度电路的成本控制需求;
  • 250:额定电压(25V DC),3位编码简化识别;
  • NSPJ:端电极与封装细节(无铅镀锡,符合RoHS标准)。

核心参数汇总:

参数项 具体规格 容值 22μF 精度 ±20%(M级) 额定电压 25V DC 温度系数 X5R 封装 1206(SMD) 环保标准 RoHS无铅无卤

二、封装与物理特性

1206封装是电子行业应用最广泛的贴片电容规格,适配90%以上常规SMD贴片机(如ASM、FUJI系列),吸嘴无需特殊定制。华瓷该型号的物理特性细节:

  • 尺寸:3.2mm×1.6mm×1.0mm(典型厚度,批次波动±0.1mm);
  • 焊盘适配:符合IPC标准(焊盘间距0.5mm,宽度0.6mm),可避免焊接立碑、桥连缺陷,批量良率≥99.5%;
  • 结构:多层陶瓷叠层+镍(Ni)内部电极+无铅镀锡(Sn)端电极,抗硫化性能优于传统银电极,适合潮湿环境。

三、电气性能与稳定性

该型号的核心优势在于参数平衡,兼顾容量、温度稳定性与成本:

  1. 电压适配性:25V额定电压覆盖5V/12V主流低压系统,降额使用(工作电压≤20V)时,85℃环境下理论寿命超10000小时;
  2. 温度稳定性:X5R温度系数(-55℃~+85℃,容值变化≤±15%),比Y5V(ΔC±22%)更稳定,适合室内设备温度波动(如夏季30℃、冬季10℃);
  3. 频率特性:谐振频率约10kHz1MHz,可有效滤除DC-DC输出的100kHz500kHz纹波,高频响应优于电解电容,无极性设计简化电路布局。

四、典型应用场景

因参数匹配度高,该型号广泛用于以下场景:

  1. 消费电子:智能手机/平板的DC-DC降压滤波、音频耦合;智能手表电源管理;
  2. 小型家电:遥控器、智能插座的EMI滤波、电源稳压;加湿器控制电路;
  3. 工业物联网:温湿度传感器节点、小型PLC的I/O接口滤波;低功耗无线模块(蓝牙/WiFi)的辅助滤波;
  4. 汽车电子(辅助级):车载USB充电口滤波(12V系统降额使用)。

五、选型与替代参考

  • 同品牌替代:华瓷HGC1206R5226M250NSPK(端电极细节差异,完全兼容);
  • 跨品牌替代:三星CL10B226MQ5NNNC、TDK C1206X5R1E226M050AA(参数1:1匹配);
  • 升级建议:若需更高温度稳定性(-55℃~+125℃),可切换X7R版本(如华瓷HGC1206R5226M250XSPJ);若需更高精度,可选择J级(±5%)同系列产品。

该型号以高性价比、稳定可靠性成为消费电子与工业控制领域的常用选择,适合批量生产与成本敏感型项目。

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