WMSIC Electronic Components

Chinocera HGC1210R7226K250NSVK

ModelHGC1210R7226K250NSVK
Package1210
BrandCHINOCERA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
Chinocera HGC1210R7226K250NSVK
Type
CHINOCERA
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CHINOCERA
Electronic Component
HGC1210R7226K250NSVK
Electronic Component
1
Electronic Component
22uF
Package
1210
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.128g
Electronic Component
1
Electronic Component
BM0266131691
Electronic Component
X7R
Voltage
25V
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

华瓷HGC1210R7226K250NSVK多层陶瓷电容(MLCC)产品概述

一、产品核心身份与定位

HGC1210R7226K250NSVK是华瓷(Chinocera)推出的1210封装X7R介质多层陶瓷电容(MLCC),属于通用型中低压陶瓷电容范畴。其料号命名逻辑清晰:HGC为华瓷MLCC系列代码,1210对应英制封装尺寸(公制3225),R7关联X7R温度特性,226表示容值22μF(22×10⁶pF),K为±10%精度,250对应额定直流电压25V,NSVK为封装细节与编带规格。该产品主打高性价比、宽温稳定性,适配中低端工业、消费电子及车载辅助电路等场景。

二、关键电气性能参数

参数项 规格值 测试/使用备注 标称容值 22μF 容差±10%(K级) 额定直流电压(Vdc) 25V 交流有效值(Vac)需降额至12V以下 温度系数 X7R -55℃~+125℃,容值变化±15%以内 损耗角正切(tanδ) ≤5% 测试条件:1kHz、25℃ 漏电流(IR) ≤10μA 测试条件:25V、25℃、1min 直流偏置容值变化 ≤-15%(25V偏置下) 偏置电压越高,容值下降越明显

三、封装与物理特性

  • 封装尺寸:英制1210(3.2mm×2.5mm),公制3225,符合IPC-J-STD-001标准;
  • 厚度:常规1.0mm(部分批次1.2mm,需确认具体料号批次);
  • 电极结构:内部镍电极+外部镀锡端电极,无铅设计(符合RoHS 2.0);
  • 编带规格:通常采用8mm编带,卷盘装(5000pcs/盘),适配SMT高速贴装设备。

四、温度特性与稳定性

X7R介质是该产品的核心优势之一:

  • 宽温范围:支持-55℃至+125℃工作环境,满足工业级设备的温度波动需求(如北方户外控制柜、南方高温车间);
  • 容值稳定性:全温区内容值变化率控制在±15%以内,远优于Y5V(±20%~-82%)等高介电常数介质,避免电路性能随温度漂移;
  • 高温损耗控制:125℃高温下tanδ≤8%,仍保持较低损耗,防止电路发热过大影响寿命。

五、典型应用场景

  1. 消费电子:智能手机/平板的电池供电电路去耦、音频模块滤波(降低底噪);
  2. 工业控制:PLC(可编程逻辑控制器)的信号滤波、小型开关电源模块(24V系统适配);
  3. 车载辅助电路:车载音响、仪表盘的12V电源滤波(需确认整车EMC要求,可搭配EMI滤波器使用);
  4. 通信设备:小型路由器、交换机的电源线路滤波(抑制高频纹波);
  5. 家电产品:智能电视、变频空调的控制板抗干扰滤波(减少电磁干扰对MCU的影响)。

六、可靠性与环境适应性

  1. 焊接兼容性:支持SMT回流焊(260℃/10s峰值温度)、波峰焊(240℃/5s),无开裂、分层风险;
  2. 机械性能:抗振动(10g~2000Hz,符合IEC 60068-2-6)、抗冲击(1000m/s²,符合IEC 60068-2-27),适合移动设备或工业振动环境;
  3. 湿热稳定性:40℃/93%RH环境下1000h测试,容值变化≤±5%,漏电流无明显上升;
  4. 环保合规:符合RoHS 2.0、REACH法规,无铅、无镉、无溴,可直接进入欧盟、北美市场。

七、选型与使用注意事项

  1. 替换参考:可兼容村田GRM188R61C226KA73D、TDK C1210X7R226K250T等同参数产品(需确认封装厚度匹配);
  2. 降额建议:直流工作电压建议≤20V(额定电压的80%),避免纹波过大导致性能衰减;
  3. 偏置影响:X7R介质在直流偏置下容值会下降,若电路偏置电压接近25V,需预留10%~15%的容值裕量;
  4. 存储条件:常温干燥环境(25℃/60%RH)下存储,开封后12个月内使用完毕,避免受潮导致端电极氧化。

该产品凭借华瓷的成熟工艺与稳定供货,成为中低端电子设备中替代进口品牌的高性价比选择,尤其适合对成本敏感但要求宽温稳定的场景。

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