WMSIC Electronic Components

Chinocera HGC1206R5226K160NSPJ

ModelHGC1206R5226K160NSPJ
Package1206
BrandCHINOCERA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 174836

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
Chinocera HGC1206R5226K160NSPJ
Type
CHINOCERA
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
CHINOCERA
Electronic Component
HGC1206R5226K160NSPJ
Electronic Component
1
Electronic Component
22uF
Package
1206
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.077g
Electronic Component
1
Electronic Component
BM0266225558
Electronic Component
X5R
Voltage
16V
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HGC1206R5226K160NSPJ 多层陶瓷电容(MLCC)产品概述

一、产品基本属性

HGC1206R5226K160NSPJ是华瓷(Chinocera)自主研发的多层陶瓷电容(MLCC),针对小型化、高可靠性电子设备设计,核心参数清晰明确:

  • 封装规格:1206(英制,对应公制3216),尺寸为1.2mm×0.6mm×0.8mm,适配主流表面贴装(SMT)工艺,支持回流焊/波峰焊;
  • 容值与精度:标称容值22μF(料号“226”表示22×10⁶pF),精度±10%(“K”级),满足多数电路对容值偏差的实用需求;
  • 额定电压:16V DC(料号“160”对应),适用于低电压供电系统;
  • 温度系数:X5R(料号“R5”标识),可在-55℃~+85℃范围内稳定工作,容值变化≤±15%;
  • 环保与认证:符合RoHS无铅标准,端电极采用镀锡工艺,适配环保焊接要求。

二、核心性能优势

该产品依托华瓷成熟的MLCC叠层制程,具备三大核心优势:

  1. 宽温稳定性突出:X5R温度特性避免了温度波动对容值的显著影响,适用于户外设备低温启动、工业设备高温运行等场景;
  2. 高容值密度:1206小封装实现22μF/16V的高容值,可替代同容值电解电容,大幅缩小电路板尺寸;
  3. 低阻抗响应快:MLCC固有的低等效串联电阻(ESR≈10mΩ@1kHz)和低等效串联电感(ESL≈0.5nH@100MHz),能快速滤除高频噪声,提升电路抗干扰能力。

三、典型应用场景

因尺寸紧凑、性能稳定,该电容广泛覆盖以下领域:

  1. 消费电子终端:智能手机、智能手表的电源滤波/耦合电路,降低设备体积;
  2. 通信设备:路由器、交换机的信号旁路电容,保障高频信号传输稳定;
  3. 工业控制模块:小型PLC、物联网传感器节点的电源稳压,适应工业环境温变;
  4. 车载辅助电路:车载中控、仪表盘的低电压滤波,满足-40℃~+85℃的车载温度要求。

四、电气与机械规格补充

  • 电气性能:25℃下漏电流≤0.01μA(CV值),16V DC额定电压下可长期稳定工作;
  • 机械性能:封装尺寸公差±0.2mm,焊接强度≥2N,回流焊峰值温度260℃(3次循环)无损坏;
  • 环境适应性:存储温度-40℃~+125℃,湿热环境(85℃/85%RH,1000小时)下容值变化≤±10%。

五、可靠性与质量保障

华瓷对该产品执行严格可靠性测试:

  • 高温负载测试(125℃、16V DC,1000小时):容值变化≤±10%,漏电流≤初始值150%;
  • 温度循环测试(-55℃~+85℃,1000次):无外观裂纹,性能无衰减;
  • 振动测试(10~2000Hz,2g加速度):无机械损坏,功能正常。

该产品性价比突出,可满足中低端电子设备对小封装、高容值、宽温稳定电容的核心需求,是替代传统电解电容的优选方案。

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