Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FCH1050-330M是方成(FC)品牌推出的SMD贴片式一体成型功率电感,专为中等功率密度的电源电路设计,兼具低EMI、高电流承载、小尺寸等核心优势,广泛适配消费电子、工业控制、通信设备等领域的DC-DC转换、滤波等场景。
该电感属于功率电感范畴,区别于传统绕线电感,采用一体成型磁粉芯工艺,通过压制形成无气隙结构,有效降低漏磁与电磁干扰(EMI);同时针对中等功率需求优化电流承载能力,额定电流达5A,饱和电流6A,满足多数便携设备、小型电源模块的稳定工作要求。其核心价值在于:在紧凑尺寸(11.5×10.5mm)下实现高电感值(33uH)与低损耗(72mΩ DCR)的平衡,兼顾性能与空间利用率。
FCH1050-330M的核心参数明确,可直接支撑电路设计选型:
参数类别 具体指标 说明 电感值 33uH ±20% 标准电感容量,满足滤波/储能需求 额定电流(Ir) 5A 电感值下降≤10%时的最大电流(行业常规定义) 饱和电流(Isat) 6A 电感值下降至初始值30%以内的最大电流 直流电阻(DCR) 72mΩ(典型值) 低电阻降低功率损耗,提升效率 封装类型 SMD贴片(11.5×10.5mm) 长×宽尺寸,适配常规PCB贴装 类型 一体成型功率电感 磁粉芯一体压制,低EMI 品牌 方成(FC) 国内专业电感制造品牌FCH1050-330M采用SMD贴片封装,尺寸为11.5mm(长)×10.5mm(宽),属于小型化功率电感范畴,可直接兼容常规PCB的贴片工艺,无需特殊治具或加工要求。其封装设计符合IPC标准,焊接可靠性高,耐回流焊温度(最高260℃/10秒),适配自动化生产流程,降低制造端成本。
FCH1050-330M的性能适配多领域中等功率电路,核心应用包括:
方成(FC)作为国内专注于电感研发制造的品牌,FCH1050-330M具备以下可靠性优势:
综上,FCH1050-330M是一款性能均衡、可靠性高的一体成型功率电感,在中等功率电源电路中具备显著的空间与性能优势,是电子设计工程师的实用选型之一。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products