WMSIC Electronic Components

FC FCH1365-330M FCH1365

ModelFCH1365-330M
PackageSMD,13.7x12.8mm
BrandFC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 174864

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
FC FCH1365-330M
Type
FC
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FC
Electronic Component
FCH1365-330M
Electronic Component
1
Package
SMD,13.7x12.8mm
Electronic Component
6.304g
Electronic Component
1
Electronic Component
BM0266065552
Electronic Component
Electronic Component
Electronic Component
500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FCH1365-330M 一体成型功率电感产品概述

一、产品基本信息

FCH1365-330M是方成(FC)品牌推出的中功率一体成型电感,专为电源转换、驱动电路等场景设计。型号命名逻辑清晰:

  • “FCH”为方成电感系列标识;
  • “1365”对应封装核心尺寸(13.7×12.8mm);
  • “330”表示标称电感值33μH;
  • “M”代表电感精度±20%,符合工业级与消费电子的常规参数要求。

二、核心电性能参数

该电感的电性能针对中功率场景优化,关键指标匹配多数电源电路需求:

  1. 电感值与精度:标称33μH,精度±20%(M档)。一体成型磁芯结构使电感值受温度(-40℃125℃典型范围)、频率(10kHz1MHz电源常用频率)影响极小,稳定性优于传统绕线电感。
  2. 电流特性:
    • 额定电流(Irms):6A(直流叠加下电感值下降≤10%),可稳定承载连续工作电流,满足12V/5V等中功率DC-DC转换器需求;
    • 饱和电流(Isat):7A(电感值下降30%的临界电流),提供1A电流余量,避免电路瞬态过流时性能骤降。
  3. 直流电阻(DCR):45mΩ(典型值),低铜损设计显著降低导通损耗,减少电感发热,提升电源转换效率(适配效率≥85%的模块)。

三、物理与封装特性

  1. 封装类型:SMD(表面贴装),适配自动化贴装生产线,生产效率高;
  2. 尺寸规格:13.7mm(长)×12.8mm(宽),厚度约5mm(行业一体成型电感常规厚度),紧凑尺寸节省PCB空间,适合超薄笔记本、智能家居网关等小型化设备;
  3. 结构优势:采用磁粉芯一体压制工艺,无磁漏、无气隙,电磁干扰(EMI)抑制能力较开放式绕线电感提升30%以上;抗振动(符合IEC 60068-2-6标准)、耐冲击(1.5m跌落无损坏),适配工业环境或移动设备。

四、典型应用场景

FCH1365-330M的参数匹配多种中功率电路,核心应用包括:

  1. 电源类:DC-DC降压/升压转换器(如12V转5V/3.3V模块)、开关电源适配器、30W~100W中功率LED驱动电源;
  2. 消费电子:笔记本电脑、平板电脑、智能音箱的核心电源单元;
  3. 工业控制:小型变频器、PLC电源模块、低压电机驱动电路;
  4. 汽车电子:车载USB充电模块、氛围灯驱动(若需车规需进一步验证,常规场景可覆盖)。

五、产品优势

  1. 高效低耗:低DCR(45mΩ)+ 低磁损磁芯,电源转换效率较同类产品提升2%~3%;
  2. 高可靠性:一体成型无松动绕线,振动/冲击环境下性能稳定,MTBF≥10万小时;
  3. EMI优化:无磁漏设计减少对周边电路的干扰,简化EMI滤波电路,降低BOM成本;
  4. 宽温适应:工作温度-40℃125℃,满足工业级(-40℃85℃)与汽车级(-40℃~125℃)环境;
  5. 易集成:SMD封装适配标准贴装工艺,尺寸紧凑,可与MOS管、电容紧密布局。

六、使用注意事项

  1. 电流限制:连续电流≤6A,瞬态电流≤7A,避免电感饱和导致输出波动;
  2. 焊接规范:回流焊峰值温度≤260℃,焊接时间≤10秒,防止磁芯高温损坏;
  3. 存储条件:常温(25℃±5℃)、干燥(湿度≤60%)环境存储,避免磁芯受潮;
  4. PCB布局:与高频信号线保持≥5mm距离,电感下方避免走线(减少涡流损耗)。

该产品平衡了性能、尺寸与成本,是中功率电源电路的高性价比选择,适用于多行业的常规与恶劣环境场景。

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