WMSIC Electronic Components

FC FC-SE2014-470M

ModelFC-SE2014-470M
PackageSMD
BrandFC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 174894

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
FC FC-SE2014-470M
Type
FC
Minimum package
1120 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FC
Electronic Component
FC-SE2014-470M
Electronic Component
1
Package
SMD
Electronic Component
15.9g
Electronic Component
1
Electronic Component
BM0266065535
Electronic Component
Electronic Component
Electronic Component
1120

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FC-SE2014-470M 扁平线功率电感产品概述

一、产品核心定位

FC-SE2014-470M是方成(FC)品牌针对大电流功率转换场景设计的扁平线电感,聚焦高密度电子设备对“高电流承载、低损耗、小型化”的核心需求,兼顾工业级可靠性与自动化生产兼容性,可广泛适配电源模块、汽车电子、通信设备等领域。

二、关键参数与性能优势

1. 电感值与精度

标称电感量47uH,精度±20%,满足多数DC-DC转换器、滤波电路的电感量匹配需求,无需额外复杂调试,降低系统设计复杂度。

2. 电流承载能力

  • 额定电流(Irms):11A(连续工作电流,电感升温不超过规定值),可稳定支撑大电流输出场景;
  • 饱和电流(Isat):6A(电感值下降30%时的峰值电流),实际应用需控制工作电流低于此值,避免电感饱和导致电感量骤降、电路纹波异常。

3. 直流电阻(DCR)

仅5.35mΩ的低DCR设计,大幅降低铜损(11A工况下铜损约0.65W),减少发热同时提升电源转换效率,适合高密度电源模块的热管控。

4. 结构类型

采用扁平线绕制,相比传统圆线电感:

  • 表面积更大,电流分布更均匀,高频下趋肤效应影响更小(适配100kHz以上开关频率);
  • 同体积下电感密度更高,实现“小体积+大电流”的平衡。

三、结构设计与封装特点

1. 扁平线绕制优势

扁平线的宽薄特性使绕制时线间间隙更小,既提升电感密度,又降低交流电阻(ACR)损耗,高频性能优于圆线电感。

2. SMD封装兼容性

表面贴装式设计适配自动化SMT产线,支持回流焊、波峰焊等工艺,可批量生产;封装尺寸紧凑,节省PCB空间,符合小型化设备趋势。

3. 环保与可靠性

采用无铅工艺,符合RoHS环保标准;电感结构稳定,抗振动、抗冲击性能满足工业级设备(如服务器、工业控制器)的严苛环境需求。

四、典型应用场景

FC-SE2014-470M的性能匹配多类大电流功率场景:

  1. 工业电源:服务器电源、工业控制电源的DC-DC降压模块(如12V转5V/3.3V大电流输出);
  2. 汽车电子:车载充电机(OBC)、DC-DC转换器(12V/48V转换)、电动座椅/车灯的功率驱动电路;
  3. 通信设备:基站电源、路由器/交换机的电源模块,满足高功率密度、低损耗需求;
  4. 消费电子:高端笔记本电脑、游戏主机的电源适配器,实现小型化与高效率。

五、使用注意事项

  1. 电流限制:实际工作电流需控制在饱和电流(6A)以下,避免电感饱和导致电路异常;
  2. 温度管控:连续工作时电感表面温度不超过105℃(工业级标准),需配合散热设计;
  3. 焊接工艺:遵循SMD封装回流焊温度曲线,避免过高温度损坏电感结构。

FC-SE2014-470M以“高电流、低损耗、小型化”为核心优势,是大电流功率转换场景的高性价比选择,可有效提升系统效率与可靠性。

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