WMSIC Electronic Components

HONOR HV1A227M0605PZ

ModelHV1A227M0605PZ
PackageSMD,D6.3xL5.8mm
BrandHONOR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 174922

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HONOR HV1A227M0605PZ
Type
HONOR
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HONOR
Electronic Component
HV1A227M0605PZ
Electronic Component
1
Electronic Component
220uF
Package
SMD,D6.3xL5.8mm
Electronic Component
Capacitor
Electronic Component
±20%
Electronic Component
0.47g
Pitch
2.2mm
Electronic Component
1
Electronic Component
BM0266080776
Electronic Component
2000hrs
Operating Temperature
55℃~+105℃
Voltage
10V
Capacitor
6.3mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HV1A227M0605PZ 贴片固态电解电容产品概述

HV1A227M0605PZ是HONOR(荣誉)品牌推出的通用型贴片固态电解电容,专为低中压、小体积场景设计,兼顾可靠性与成本优势,广泛适配消费电子、小型工业及可穿戴设备的电源滤波与耦合需求。

一、产品型号解析与核心定位

型号“HV1A227M0605PZ”包含明确性能标识:

  • HV1A:低中压固态电解电容系列代号;
  • 227:容值编码(前两位有效数+幂次,单位pF),即22×10⁷pF=220μF;
  • 0605:封装尺寸(直径×长度),对应φ6.3mm×L5.8mm;
  • PZ:极性与封装优化标识,适配常规SMT焊接工艺。

该产品定位为通用型小体积固态电解电容,替代传统液态电容的同时,解决漏液、干涸等可靠性问题,满足小型化设备的高密度布局需求。

二、基础性能参数详解

参数项 规格值 实际意义说明 标称容值 220μF 覆盖电源滤波、耦合的主流容值需求 容值精度 ±20% 满足90%以上通用电路的精度要求 额定电压 10V DC 适配5V、12V系统的辅助电源电路 封装尺寸(体) φ6.3mm×L5.8mm 体积仅0.18cm³,比同容值液态电容小30% 脚间距 2.2mm 兼容主流SMT贴片机,焊接容错率高 工作温度范围 -55℃~+105℃ 覆盖户外、工业环境的温度变化 工作寿命(105℃下) 2000hrs 高温环境下长期可靠,常温下可用5~8年 封装类型 SMD(表面贴装) 无引线设计,减少寄生电感,提升滤波效果

三、核心技术优势

相比传统液态电解电容,固态电解质设计带来显著突破:

3.1 电解质稳定性高

采用导电聚合物固态电解质,无液态电解液,彻底避免漏液、干涸、容值衰减问题;ESR(等效串联电阻)更低且长期稳定,滤波效果优于液态电容,适合高频电路电源滤波。

3.2 宽温适应性强

-55℃~+105℃的工作范围,可覆盖:

  • 消费电子:手机夏季高温(≈40℃)、冬季低温(≈-10℃)使用;
  • 工业场景:小型传感器模块户外环境(-20℃~85℃);
  • 可穿戴:智能手环户外佩戴(-30℃~50℃)。

3.3 小体积高密度

φ6.3mm×L5.8mm的封装适配:

  • 智能手机主板高密度布局;
  • 蓝牙耳机充电仓、智能手表狭小空间;
  • 小型家电控制板紧凑设计。

3.4 生产兼容性好

2.2mm脚间距符合IEC标准,适配富士、西门子等主流SMT贴片机;无铅焊接工艺兼容性强,焊接不良率低于0.1%,提升生产线效率。

四、典型应用场景

HV1A227M0605PZ的参数特性决定其在以下场景的核心价值:

4.1 消费电子终端

  • 智能手机/平板:PMU电源管理单元滤波电容,替代液态电容解决长期容值衰减;
  • 蓝牙耳机/充电仓:充电电路耦合电容,小体积适配迷你空间;
  • 智能音箱:音频电路滤波电容,提升音质稳定性。

4.2 小型工业控制

  • 低功率PLC模块:辅助电源滤波电容,适应工业宽温环境;
  • 传感器节点:温湿度、压力传感器电源滤波,提升信号稳定性;
  • 小型电机驱动:低功率直流电机控制电路耦合。

4.3 可穿戴与IoT设备

  • 智能手环/手表:心率、计步传感器电源滤波,宽温适应户外;
  • 智能家居节点:智能插座、温湿度传感器控制板电容,满足小体积需求。

五、可靠性与质量保障

  1. 环保认证:通过RoHS 2.0、REACH认证,符合欧盟市场准入要求;
  2. 寿命测试:105℃下2000hrs寿命测试(符合JIS C 5102标准),常温下可用5~8年;
  3. 环境可靠性:通过高低温循环(-55℃~105℃,50次)、湿热测试(85℃/85%RH,1000hrs),满足工业级基础可靠性;
  4. 极性标识清晰:电容体极性丝印明确,避免焊接反接损坏,提升生产良率。

总结

HV1A227M0605PZ是高性价比通用型贴片固态电解电容,以固态电解质稳定性、小体积适配性、宽温适应性为核心优势,覆盖多领域电源滤波与耦合需求,是替代传统液态电容的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.