WMSIC Electronic Components

HONOR VP1H101M0607

ModelVP1H101M0607
PackageSMD,D6.3xL7.7mm
BrandHONOR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 174928

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HONOR VP1H101M0607
Type
HONOR
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HONOR
Electronic Component
VP1H101M0607
Electronic Component
1
Electronic Component
100uF
Package
SMD,D6.3xL7.7mm
Electronic Component
SMD Aluminum Electrolytic Capacitor
Electronic Component
±20%
Electronic Component
0.63g
Electronic Component
1
Electronic Component
BM0266080729
Operating Temperature
55℃~+105℃
Current
80mA
Voltage
50V
Capacitor
6.3mm
Capacitor
7.7mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

VP1H101M0607 贴片电解电容产品概述

VP1H101M0607是HONOR品牌推出的一款高压中小容量贴片电解电容,针对紧凑电路设计的小体积封装,兼顾宽温适应性与基础滤波性能,适用于消费电子、工业控制等多场景的电源滤波、耦合环节。

一、核心参数概览

该产品的关键电气与物理参数明确,可满足多数常规电路的设计需求:

  • 容值与精度:标称容量100μF(对应三位代码“101”,即10×10¹μF),精度±20%,符合工业级电解电容的通用精度要求,无需额外匹配高精度元件;
  • 额定电压:50V直流耐压,支持12V/24V系统升压后的电路(如12V转48V辅助电源),实际使用建议遵循80%降额原则(≤40V),提升长期可靠性;
  • 纹波电流能力:80mA(典型值,20℃/120Hz条件下),可有效滤除中等功率电路中的交流纹波,避免干扰敏感元器件(如MCU、传感器);
  • 温度范围:-55℃~+105℃宽温设计,覆盖极端环境下的工作需求(如低温户外、高温设备内部);
  • 封装尺寸:电容体直径6.3mm、长度7.7mm,SMD贴片封装,兼容主流PCB贴装工艺。

二、封装与物理特性

VP1H101M0607采用小型化SMD封装,尺寸(D6.3×L7.7mm)在同容量/耐压的贴片电解中属于紧凑规格,核心优势体现在:

  1. PCB空间优化:小直径与短长度设计,适合高密度贴装场景(如小型开关电源、便携设备主板),可减少电路布局占用面积;
  2. 贴装兼容性:支持回流焊、波峰焊工艺(需遵循厂家推荐的温度曲线),适配自动化生产,降低人工成本;
  3. 机械稳定性:引脚间距与尺寸符合行业标准,焊接后抗振动性能较好,可应对设备运输或运行中的轻微振动。

三、电气性能亮点

该产品的电气性能聚焦基础滤波与稳定性,满足常规电路的核心需求:

  1. 容量稳定性:在-55℃~+105℃范围内,容量变化率控制在行业允许区间(如105℃下容量变化≤+20%),避免极端温度下性能波动;
  2. 纹波抑制:80mA纹波电流能力可覆盖0.5W~2W中等功率电路的滤波需求(如手机充电器次级滤波、LED驱动电源);
  3. ESR特性:等效串联电阻(ESR)处于同类产品合理水平(典型值约10Ω~20Ω,20℃/100kHz),可减少纹波抑制时的自身发热,延长使用寿命;
  4. 耐压可靠性:额定50V耐压经过厂家测试验证,无漏液、击穿等风险,适合长期工作在低压直流系统中。

四、适用场景解析

VP1H101M0607的参数特性使其适配多类电子设备的具体场景:

  1. 小型开关电源:如5V/2A手机充电器、12V/1A LED驱动电源的次级滤波电容,小体积匹配电源模块紧凑设计;
  2. 工业控制模块:PLC输入输出接口、传感器节点的耦合电容,宽温范围适应车间高低温环境;
  3. 消费电子:便携式蓝牙音箱、智能插座的电源滤波,小尺寸利于便携设备的轻量化设计;
  4. 汽车低压辅助电路:车载12V系统的非关键辅助电路(如车内氛围灯驱动),-55℃~105℃温度范围接近汽车级要求。

五、可靠性与环境适应性

该产品的可靠性设计针对宽温与常规环境优化:

  1. 温度适应性:低温下电解液无凝固,容量保持率≥80%;高温下电解液挥发速率符合行业标准,105℃下寿命约1500小时(典型值),满足一般设备的使用周期;
  2. 防潮性:贴片封装采用防潮涂层,可应对相对湿度≤85%的环境(如室内、温带户外);
  3. 焊接可靠性:引脚采用镀锡工艺,焊接强度符合IPC标准,可承受多次回流焊(≤3次)。

总结

VP1H101M0607是一款性价比突出的贴片电解电容,在小体积、宽温范围与中等容量之间实现平衡,适合对尺寸敏感、无需高精度的常规电子电路。HONOR品牌的工艺保障使其在工业与消费场景中具备稳定表现,是电源滤波、耦合环节的实用选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.