Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RVT1A221M0605是HONOR品牌推出的小型化低压贴片铝电解电容,针对紧凑空间内的低压滤波、储能需求设计,兼顾成本与性能稳定性,适配消费电子、小型工业设备等多场景的标准化应用,是低压电路中替代体积更大的插件电解电容的优选方案。
产品采用SMD贴片封装,尺寸6.3×5.4mm(直径×长度),符合标准SMT(表面贴装技术)工艺要求,可通过自动化贴片机批量生产,大幅提升组装效率,降低人工成本。
引脚设计为径向贴片式,与PCB焊盘匹配度高,回流焊过程中无虚焊风险(建议参考常规贴片电解电容回流焊温度曲线:峰值温度≤240℃,保温时间≤60秒);手工焊接时需注意烙铁温度≤350℃,焊接时间≤3秒,避免损坏电容体。
HONOR品牌针对该电容采用成熟的铝电解生产工艺,产品符合IEC 60384-4(固定铝电解电容器标准),出厂前经过高低温循环测试(-55℃~+105℃,100次循环)、耐压测试(1.5倍额定电压,持续1分钟)、漏电流测试(105℃下,漏电流≤初始值150%)等多重质检,确保批量一致性。
2000hrs@105℃的寿命测试表明,产品在高温工况下容值衰减≤20%、等效串联电阻(ESR)变化≤30%,满足工业级可靠性要求。
该产品以紧凑尺寸、宽温特性和稳定寿命,成为低压小型化电路的高性价比选择,适配多领域的标准化设计需求。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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