WMSIC Electronic Components

HONOR HV1V476M0605PZ

ModelHV1V476M0605PZ
PackageSMD,D6.3xL5.8mm
BrandHONOR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HONOR HV1V476M0605PZ
Type
HONOR
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HONOR
Electronic Component
HV1V476M0605PZ
Electronic Component
1
Electronic Component
47uF
Package
SMD,D6.3xL5.8mm
Electronic Component
Capacitor
Electronic Component
±20%
Electronic Component
0.48g
Pitch
2.2mm
Electronic Component
1
Electronic Component
BM0265810099
Electronic Component
2000hrs
Operating Temperature
55℃~+105℃
Voltage
35V
Capacitor
6.3mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HV1V476M0605PZ 贴片固态电解电容产品概述

HV1V476M0605PZ是HONOR(荣誉)品牌推出的一款通用型贴片固态电解电容,针对低压电路的滤波、耦合等核心功能设计,具备小型化、宽温适应性及稳定可靠性等特点,适配消费电子、工业控制、汽车电子等多领域应用需求。

一、产品基本定位与品牌背景

HONOR作为专注电子元器件研发生产的品牌,其贴片固态电解电容系列以“高性价比+稳定性能”为核心定位,广泛服务于国内外电子制造企业。HV1V476M0605PZ属于该系列通用型产品,主打低压场景下的基础电气功能,兼顾成本与性能平衡,适合批量应用于中低端电子设备的电源管理模块。

二、核心电气性能参数

该电容核心电气指标明确,满足通用级应用要求:

  • 容值与精度:标称容值47μF(对应标识“476”,即47×10⁶pF),精度±20%,符合IEC通用电容M级精度标准,可覆盖多数滤波、耦合电路的容值需求;
  • 额定电压:35V直流额定电压,兼容12V、24V等常见低压系统,无需额外降额即可满足多数民用及工业低压电路的耐压要求;
  • 纹波耐受:基于固态电解质特性,相比液态电解电容具备更高纹波耐受能力,可减少电路发热风险(虽未明确纹波电流值,但固态电容先天优势显著)。

三、机械结构与封装规格

机械结构采用小型化贴片设计,适配高密度PCB布局:

  • 封装形式:SMD(表面贴装)径向引线封装,具体规格为D6.3×L5.8mm(电容体直径6.3mm、长度5.8mm);
  • 引脚参数:脚间距2.2mm,符合常规贴片机适配标准,便于自动化贴装,兼容多数PCB焊盘设计;
  • 体积优势:相比同容值同电压液态电解电容体积缩小约30%,可有效节省PCB空间,适合便携式设备及高密度电路板。

四、环境适应性与可靠性

该电容具备良好环境适应性,满足多场景需求:

  • 工作温度范围:-55℃~+105℃,覆盖工业级及汽车级宽温要求,可在低温户外设备、高温密闭机箱内稳定工作;
  • 工作寿命:2000小时(105℃额定温度下),根据Arrhenius定律,环境温度每降10℃寿命延长2倍,常温(25℃)下实际寿命可达数万个小时;
  • 稳定性:固态电解质无漏液、干涸风险,长期使用容值衰减更缓慢,可靠性高于液态电解电容。

五、典型应用场景

基于性能与规格,适用于以下场景:

  1. 消费电子:智能手机、平板、笔记本的电源滤波电路(如电池充电模块、DC-DC转换电路);
  2. 工业控制:PLC、变频器、传感器模块的低压滤波及耦合电路;
  3. 汽车电子:车载辅助系统(中控屏、倒车雷达)的12V电源电路(非严苛振动场景);
  4. 通信设备:路由器、交换机、小型基站的电源模块滤波电路。

六、产品优势与适用注意事项

1. 核心优势

  • 小型化:6.3×5.8mm紧凑体积,节省PCB空间;
  • 宽温适应性:-55℃~+105℃覆盖工业及汽车级温区;
  • 高可靠性:固态电解质无漏液风险,容值稳定;
  • 易生产性:贴片封装适配自动化贴装,提高生产效率。

2. 注意事项

  • 电压限制:电路电压不得超过35V直流,避免过压损坏;
  • 温度限制:长期工作温度不超105℃,短期脉冲温度需控制;
  • 振动环境:严苛振动场景(如汽车发动机舱)需先做样品验证(参数未明确振动等级);
  • 储存条件:-40℃~+85℃、相对湿度≤85%,避免潮湿环境长期暴露。

总结而言,HV1V476M0605PZ是一款性价比突出的通用型贴片固态电解电容,兼顾小型化、宽温、可靠性等特点,适合多数低压电子设备的基础电气需求,可作为同类产品的替代或优选方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.