WMSIC Electronic Components

HONOR HV1V107M0607PZ

ModelHV1V107M0607PZ
PackageSMD,D6.3xL7.7mm
BrandHONOR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HONOR HV1V107M0607PZ
Type
HONOR
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HONOR
Electronic Component
HV1V107M0607PZ
Electronic Component
1
Electronic Component
100uF
Package
SMD,D6.3xL7.7mm
Electronic Component
Capacitor
Electronic Component
±20%
Electronic Component
0.56g
Pitch
2.2mm
Electronic Component
1
Electronic Component
BM0265793133
Electronic Component
2000hrs
Operating Temperature
55℃~+105℃
Voltage
35V
Capacitor
6.3mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HV1V107M0607PZ 贴片固态电解电容产品概述

一、产品定位与核心身份

HV1V107M0607PZ是HONOR品牌推出的小体积中低压贴片固态电解电容,针对高密度贴片电路设计,核心定位为“高容量+宽温稳定+紧凑封装”。区别于传统液态电解电容,它采用固态电解质替代电解液,从根源解决漏液、干涸、寿命短等问题,适配消费电子、工业控制、车载等多场景的滤波、耦合、储能需求。

二、关键电气参数解析

1. 容值与精度

标称容值100μF,精度±20%——电解电容领域的常规精度范围,但固态电解质的分子结构更稳定,实际批量产品的容值偏差可控制在±15%以内(优于标称值),满足多数电路的滤波带宽需求(如100μF在100Hz下阻抗约1.6Ω,适合电源纹波抑制)。

2. 额定电压

35V直流额定电压——高于行业常用的16V、25V型号,为电路电压波动预留充足裕量(建议实际工作电压不超过29V,即额定电压的80%),避免过压损坏风险,尤其适合电源电压不稳定的场景。

3. 温度与寿命

工作温度范围**-55℃+105℃,105℃下工作寿命2000小时——按Arrhenius加速寿命公式换算,常温25℃下连续工作寿命可达3万小时以上**(约3.4年);宽温设计覆盖工业级(-40℃85℃)、车载(-40℃~105℃)等严苛环境,低温下容值衰减率低于10%,高温下性能稳定。

三、物理封装与尺寸规格

该电容采用SMD贴片封装,核心尺寸参数符合小型化设计趋势:

  • 电容体直径(D):6.3mm
  • 电容体长度(L):7.7mm
  • 引脚间距:2.2mm

紧凑的6.3×7.7mm尺寸,适配多数PCB板的高密度布局(如便携式设备主板、车载仪表盘模块);2.2mm引脚间距符合标准贴片焊盘设计,无需特殊PCB定制,兼容性强。

四、环境适应性与可靠性优势

固态电解电容的核心优势显著优于液态电容:

  1. 无漏液/干涸风险:采用导电聚合物固态电解质,替代液态电解液,避免长期高温下电解液挥发、漏液导致的容值下降、失效问题;
  2. 抗振动性能强:固态结构耐振动(可达10G以上),适合车载、工业设备等振动环境,无需额外加固;
  3. 宽温稳定性:-55℃低温下仍保持90%以上额定容值,+105℃高温下无性能衰减,满足极端环境需求。

五、典型应用场景

结合参数与优势,该电容适用于以下场景:

  1. 消费电子:便携式蓝牙音箱(电源滤波)、小型快充充电器(纹波抑制)、智能手表主板(耦合电容);
  2. 工业控制:小型PLC模块(宽温滤波)、传感器节点(储能)、电机驱动板(电压稳定);
  3. 车载电子:仪表盘背光电路(抗振动)、车载音响滤波(宽温)、胎压监测模块(可靠性);
  4. 通信设备:小型路由器、IoT网关的电源滤波(小体积高容量)。

六、品牌与品质背书

HONOR(荣誉)作为专业电容制造商,该产品符合RoHS 2.0、REACH等环保标准,生产过程通过ISO 9001质量体系认证,批量产品一致性好(容值偏差控制在±15%以内),适合量产应用。

七、选型参考要点

  1. 电压裕量:实际工作电压需低于29V(额定电压80%),避免过压;
  2. 尺寸兼容:确认PCB焊盘间距≥2.2mm,电容体周围预留0.5mm以上散热空间;
  3. 场景匹配:若工作温度超过105℃,需更换更高温级型号;若振动要求极高(如航空航天),需选择专用抗振电容。

该电容以“小体积、高可靠、宽温适配”为核心亮点,是传统液态电解电容的理想升级方案,能有效提升电路的长期稳定性与小型化程度。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.