Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GVT1V331M0810是HONOR(荣誉)品牌推出的一款通用型贴片铝电解电容,针对小型化电子设备的电源滤波、耦合需求设计,具备宽温适应、尺寸紧凑、性能稳定等特点,可替代传统插件电解电容,适配多类消费电子、工业控制场景。
该电容属于中容量贴片电解电容,以330μF容值、35V额定电压为核心参数,采用SMD表面贴装封装,兼容自动化贴装生产线,可有效降低PCB布局空间占用,同时满足高低温环境下的长期稳定工作需求,是中小功率设备电源电路的理想选择。
容值为330μF(型号中“331”为容值标识,即33×10¹=330μF),精度±20%,符合电解电容常规精度等级,可满足大多数电路对滤波、耦合的容值偏差要求,无需额外高精度补偿。
额定电压35V DC,工作时施加电压(含纹波峰值)不得超过此值,避免电容击穿或性能衰减;短时间1.2倍额定电压过压下仍能保持基本功能,但不建议长期过压使用。
采用SMD表面贴装封装,引脚设计符合IPC标准,兼容西门子、富士等主流贴片机,贴装精度高,适合批量生产。
电容体直径8mm,长度10.2mm(用户描述“8×10.5mm”为近似值,实际公差±0.3mm),整体体积仅为常规插件电解的1/3左右,可在高密度PCB上实现紧凑布局(如小型设备电源模块)。
因尺寸紧凑、宽温稳定,该电容广泛应用于:
HONOR品牌作为电子元器件成熟品牌,该电容生产符合IEC 60384-4(铝电解电容国际标准),出厂前100%耐压测试、容值抽检,保证批次一致性;提供3年质保(批量采购可协商延长),降低客户售后风险。
该产品综合性能适配中小功率设备需求,是替代传统插件电解的高性价比选择,可满足多场景下的稳定工作要求。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products