WMSIC Electronic Components

HONOR HV1V227M0810PZ

ModelHV1V227M0810PZ
PackageSMD,D8xL10.5mm
BrandHONOR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 174974

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HONOR HV1V227M0810PZ
Type
HONOR
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HONOR
Electronic Component
HV1V227M0810PZ
Electronic Component
1
Electronic Component
220uF
Package
SMD,D8xL10.5mm
Electronic Component
Capacitor
Electronic Component
±20%
Electronic Component
1.21g
Pitch
3.1mm
Electronic Component
1
Electronic Component
BM0266080769
Electronic Component
2000hrs
Operating Temperature
55℃~+105℃
Voltage
35V
Capacitor
8mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HV1V227M0810PZ 贴片固态电解电容产品概述

HV1V227M0810PZ是HONOR品牌推出的通用型贴片固态电解电容,专为电子设备的电源滤波、储能及信号耦合场景设计,兼具体积紧凑、性能稳定、环境适应性强等特点,可满足消费电子、工业控制、通信等多领域的应用需求。

一、核心电气性能参数

该电容的电气指标经过精准优化,适配低压电路的常见需求:

  • 容值与精度:标称容值220μF,精度±20%,在通用电子电路中可提供稳定的滤波效果,无需额外高精度匹配,降低系统设计复杂度;
  • 额定电压:35V直流额定电压,覆盖5V/12V/24V等主流低压电源系统,满足设备正常工作时的电压裕量要求;
  • 低ESR特性:作为固态电解电容,相比液态电解电容具有更低的等效串联电阻(ESR),可减少电源纹波、降低自身发热,提升电路效率(具体ESR值可参考品牌 datasheet,固态设计的低ESR是核心优势)。

二、机械与封装规格

采用标准化SMD贴片封装,适配自动化生产流程,机械尺寸紧凑:

  • 封装尺寸:电容体直径8mm(D8)、长度10.5mm(L10.5),属于小型化设计,可在高密度PCB布局中灵活集成,满足设备 miniaturization 需求;
  • 引脚间距:3.1mm标准脚距,符合主流贴片机的焊接精度要求,减少虚焊、连锡等生产缺陷,提升产品良率;
  • 贴片结构:无引线直插设计,适合表面贴装工艺,可与其他SMD元件同步贴装,缩短生产周期。

三、环境适应性与可靠性

该电容针对严苛环境进行了优化,可靠性表现突出:

  • 宽温工作范围:-55℃至+105℃的温度区间,覆盖工业级设备的高低温场景(如北方户外设备、高温车间控制模块),以及消费电子的极端使用环境(如夏季高温下的手机充电模块);
  • 长寿命设计:在105℃额定温度下可稳定工作2000小时,固态电解质无干涸、漏液风险,相比液态电解电容寿命提升显著,长期使用性能衰减缓慢,适合需要长期稳定运行的设备(如工业PLC、通信基站电源模块);
  • 抗振动冲击:贴片封装结构牢固,可承受一定程度的机械振动与冲击,适配汽车电子、手持设备等易受振动影响的场景。

四、典型应用场景

HV1V227M0810PZ的参数与特性匹配多领域应用:

  1. 消费电子:智能手机、平板电脑、笔记本电脑的电源管理模块(二次滤波、储能),提升电池续航稳定性;
  2. 工业控制:PLC可编程逻辑控制器、变频器、伺服驱动器的辅助电源电路,满足工业环境的宽温与可靠性要求;
  3. 通信设备:路由器、交换机、基站的电源模块滤波,保障信号传输的稳定性;
  4. 汽车电子:车载娱乐系统、低压辅助电源(如车窗控制、仪表盘)的滤波电路,适配车载环境的温度变化;
  5. 小家电:电磁炉、电饭煲的电源滤波,提升设备效率与安全性。

五、品牌与品质保障

HONOR作为专业电子元器件品牌,该产品遵循严格的生产工艺与质量控制:

  • 环保认证:符合RoHS、REACH等国际环保标准,无铅、镉、汞等有害物质,适配绿色电子产品设计;
  • 全流程管控:从原材料采购到成品测试,每批次产品均经过电气参数一致性校验,确保性能稳定;
  • 技术支持:提供完整的datasheet与应用指导,协助工程师快速完成电路设计与调试。

总结而言,HV1V227M0810PZ贴片固态电解电容凭借稳定的电气性能、紧凑的封装、宽温可靠性及多场景适配性,成为电子设备电源设计中的高性价比选择,可有效提升系统的稳定性与效率。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.