WMSIC Electronic Components

HONOR HV1V337M1010PZ

ModelHV1V337M1010PZ
PackageSMD,D10xL10mm
BrandHONOR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 174987

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HONOR HV1V337M1010PZ
Type
HONOR
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HONOR
Electronic Component
HV1V337M1010PZ
Electronic Component
1
Electronic Component
330uF
Package
SMD,D10xL10mm
Electronic Component
Capacitor
Electronic Component
±20%
Electronic Component
1.63g
Pitch
4.5mm
Electronic Component
1
Electronic Component
BM0266080778
Electronic Component
2000hrs
Operating Temperature
55℃~+105℃
Voltage
35V
Capacitor
10mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HV1V337M1010PZ 贴片固态电解电容产品概述

HV1V337M1010PZ是HONOR品牌针对中高压电源滤波、储能场景设计的贴片固态电解电容,兼具固态电容的可靠性与贴片封装的便捷性,是工业控制、消费电子等领域替代传统液态电解电容的高性价比选择。

一、核心定位与技术优势

作为贴片固态电解电容,HV1V337M1010PZ的核心优势围绕“可靠性+适配性”展开:

  1. 电解质升级:采用固态导电聚合物替代液态电解液,彻底消除漏液、干涸、爆浆风险,长期使用无需担心性能衰减;
  2. 电气性能优化:低等效串联电阻(ESR)特性提升滤波效率,减少电源纹波干扰,同时支持快速充放电;
  3. 宽温适配:覆盖极端温度范围,满足高低温环境下的稳定工作需求,适配工业级场景。

二、关键技术参数详解

HV1V337M1010PZ的参数严格匹配目标应用,核心指标如下:

  • 容值与精度:额定容值330μF,精度±20%(标注“M”档),满足多数电源滤波的容量需求;
  • 额定电压:35V直流额定电压,可适配12V/24V系统(降额使用更安全);
  • 寿命与温度:在+105℃额定电压下工作寿命达2000小时,工作温度范围-55℃至+105℃,覆盖工业宽温要求;
  • 型号解读:“V”代表35V电压,“337”对应330μF容值(33×10⁶pF),“M”为±20%精度,“1010”对应封装尺寸。

三、封装与尺寸规格

采用SMD贴片封装,适配自动化贴装生产线,尺寸参数清晰:

  • 电容体直径(D):10mm;
  • 电容体长度(L):10mm;
  • 引脚间距:4.5mm;
  • 封装代码:1010(直径×长度10mm×10mm)。

该尺寸紧凑,可集成于空间受限的PCB设计中,无需额外散热设计(固态电容热阻低)。

四、环境适应性与可靠性

HV1V337M1010PZ针对恶劣环境优化,可靠性表现突出:

  • 温度稳定性:-55℃低温下容值变化率≤10%,+105℃高温下持续工作无性能衰减;
  • 抗振动冲击:固态结构耐振动(10g/50-2000Hz)、抗冲击(100g/1ms),适合车载、工业设备等振动场景;
  • 环保合规:符合RoHS 2.0标准,不含铅、镉等有害物质,满足全球市场要求。

五、典型应用场景

基于参数与特性,HV1V337M1010PZ广泛应用于以下领域:

  1. 工业控制:PLC、变频器辅助电源滤波,替代液态电容提升设备寿命;
  2. 消费电子:机顶盒、路由器、智能家电电源模块,解决空间紧凑与可靠性需求;
  3. 通信设备:基站电源、光模块滤波,适配宽温环境与批量贴装;
  4. 车载电子:部分宽温车载辅助电源(如音响、导航),避免漏液风险。

六、品牌与品质保障

HONOR品牌作为成熟元器件品牌,HV1V337M1010PZ出厂前经过全参数抽样测试(容值、ESR、耐压、温度循环),确保每批次一致性;同时提供3年批量质保,支持样品测试与技术咨询,满足研发生产需求。

该产品通过平衡“容量、电压、尺寸、可靠性”,成为中高压贴片电源设计的实用选择,适配多场景的电源滤波与储能需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.