WMSIC Electronic Components

WCH CH224Q

ModelCH224Q
PackageDFN-10-EP(2x2)
BrandWCH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WCH CH224Q
Type
WCH
Minimum package
3000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PD 3.2;SPR;PPS;AVS;BC 1.2
Electronic Component
WCH
Electronic Component
CH224Q
Electronic Component
1
Package
DFN-10-EP(2x2)
Type
Controller
Electronic Component
Fast-Charge Protocol IC
Electronic Component
0.044g
Electronic Component
1
Channel Count
1C
Electronic Component
BM0258761112
Operating Temperature
40℃~+105℃
Operating Voltage
4V~30V
Output Power
140W
Output Voltage
5V;20V;15V;12V;28V;9V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CH224Q 产品概述

一、产品简介

CH224Q 是南京沁恒(WCH)推出的一款受电控制器,面向高功率便携电源与充电设备。器件支持多档固定输出电压(5V、9V、12V、15V、20V、28V),最高输出功率可达 140W,适合对多电压、高功率输出有需求的应用场景。工作温度范围宽 (-40℃ 至 +105℃),适合工业级与民用复杂环境。

二、主要特性

  • 多档输出:支持 5V/9V/12V/15V/20V/28V 等常见电压档位,覆盖主流USB-PD及快充需求。
  • 高频率与高效能:针对高功率传输进行了控制优化,可实现稳定的功率输出与较高转换效率(具体效率依整机设计而定)。
  • 宽工作温度:-40℃ ~ +105℃,满足工业与车载等环境要求。
  • 小型封装:DFN-10-EP (2x2) 封装,利于小尺寸设计与模块化集成。
  • 热沉引脚(EP):裸露散热焊盘有利于PCB散热设计,提升长期可靠性。

三、典型应用

  • 高功率USB充电器与快充适配器
  • 笔记本/平板供电模块与扩展坞(Type-C PD Sink)
  • 车载充电系统与移动电源(充电模块)
  • 工业设备供电管理与多电压分配系统

四、封装与热管理

CH224Q 采用 DFN-10-EP (2×2) 小封装,中心带裸露焊盘(EP)用于热量传导。建议在PCB设计时为EP配置充足的过孔与铜箔(多层散热盲/通孔),并在元件下方与周边留出散热区域。对于靠近额定功率上限(接近 140W)运行的应用,应考虑额外散热措施,如金属散热片或增强散热层。

五、设计与使用建议

  • 与外部功率器件配合:CH224Q 多用于受电/功率管理,通常需配合合适的功率MOSFET、电感、二极管及输入/输出电容实现完整的供电方案。
  • PCB布局:输入端大电流走线要尽量短且宽;EP焊盘与散热过孔充分连接至内层或底层铜箔。
  • 滤波与稳压:在输入输出侧放置足够的去耦电容与滤波网络,减小纹波与尖峰,保证稳定输出与电磁兼容(EMC)性能。
  • 温度监控:建议在方案中加入温度检测与软关断策略,保护器件与负载安全。

六、可靠性与环境适应

宽工作温度与小型封装使 CH224Q 适应性强,适合汽车、工业与便携电子设备。设计时应关注长时间高功率运行下的热漂移、焊接可靠性与应力缓解,必要时参考厂方可靠性试验与应用笔记。

七、选型与采购注意

  • 确认所需输出档位与最大功率需求是否落在 CH224Q 支持范围内。
  • 在高功率设计(接近140W)时,核对器件在实际PCB散热条件下的温升与长期稳定性。
  • 关注封装尺寸与焊盘设计,严格按照厂方推荐的PCB焊盘与回流焊工艺进行安装。

如需更详细的电气参数、典型应用电路或参考布局,请提供具体应用场景或索取 CH224Q 的技术手册。

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