WMSIC Electronic Components

WCH CH440E

ModelCH440E
PackageMSOP-10
BrandWCH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WCH CH440E
Type
WCH
Minimum package
5000

Technical parameters

Electronic Component
WCH
Electronic Component
CH440E
Electronic Component
1
Package
MSOP-10
Electronic Component
550MHz
Electronic Component
Analog Switch / Multiplexer
Electronic Component
0.101g
Electronic Component
1
Channel Count
2
Features
Analog
Electronic Component
BM0228591402
Operating Temperature
40℃~+85℃
Operating Voltage
4V~5.5V
Switch
2:1
(ton)
3ns
Capacitor(Con)
9pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CH440E 产品概述

一、概述

CH440E 是南京沁恒(WCH)推出的一款高速双通道 2:1 模拟开关,适用于对速度和带宽有要求的信号切换场合。器件工作电压范围为 4V ~ 5.5V,工作温度覆盖 -40℃ ~ +85℃,采用 MSOP-10 小型封装,便于在紧凑电路中实现高密度布局。

二、主要特性

  • 双通道 2:1 切换结构,支持两路输入选择。
  • 工作电压:4.0V ~ 5.5V,兼容常见 5V 和低压电源系统。
  • 工作温度:-40℃ ~ +85℃,适合工业级环境。
  • 快速开关性能:导通时间 (ton) ≈ 3ns,关闭时间 (toff) ≈ 2ns,适合高频切换应用。
  • 宽带宽:典型带宽约 550MHz,适用于视频、宽带信号或高速传输链路。
  • 低导通阻抗:Ron ≈ 5Ω(典型),保证较小的幅度衰减与插入损耗。
  • 导通电容 Con ≈ 9pF,影响高频特性与匹配设计。
  • 封装:MSOP-10,节省 PCB 空间。

三、典型应用

  • 视频信号和宽带音频切换(摄像头多路切换、AV 切换)
  • ADC/DAC 前端多路复用
  • 测试测量仪器中的信号路由
  • 通讯设备中的信号选择与切换
  • 需要快速切换且占板面积受限的系统

四、关键电气参数一览

  • 通道数:2(每通道 2:1)
  • 工作电压:4V ~ 5.5V
  • 工作温度:-40℃ ~ +85℃
  • 导通电阻 Ron:5Ω(典型)
  • 导通电容 Con:9pF
  • 带宽:550MHz(典型)
  • 导通/关闭时间:ton 3ns,toff 2ns

五、设计与使用注意事项

  • 电源与控制逻辑:在 4~5.5V 范围内为器件供电,控制端应采用与 VCC 匹配的逻辑电平,避免超出推荐电压。
  • 信号范围:典型模拟开关的输入信号需限制在供电轨内(Vss~Vcc)以免进入非线性或损坏状态,若需处理负电平或超出轨信号,应增加偏置或隔直耦合处理。
  • 高频布线:由于带宽高达 550MHz,应尽量缩短敏感信号走线,采用适当阻抗匹配与终端,避免反射与串扰。
  • 去耦与地平面:VCC 旁放置 0.1µF 陶瓷去耦电容并靠近器件引脚;布局时保持良好地平面以降低寄生电感。
  • 开关瞬变:快速的 ton/toff 会引入瞬态失真或毛刺,关键通路可增加小阻尼(串联阻抗)或滤波,以保护下一级接收器免受冲击。
  • 熔断/ESD:MSOP-10 封装引脚紧凑,焊接注意回流曲线,板上考虑必要的 ESD 防护与浪涌吸收。

六、封装与热管理

MSOP-10 小封装利于高密度设计,但热阻较大,连续大电流或高开关频率下注意热量累积。保持良好热回流路径(充足的铜箔、散热通孔)可改善散热性能。

总结:CH440E 以其高速、宽带和小体积特点,适合多种信号路由与切换应用。设计时关注供电、地线布局、高频走线和瞬态控制,可发挥器件的最佳性能。

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