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WINSOK WSD6040DN56
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- WINSOK WSD6040DN56
- Type
- WINSOK
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- WINSOK
- Electronic Component
- WSD6040DN56
- Electronic Component
- 1
- Package
- DFN-8-EP(6.1x5.2)
- Electronic Component
- 1 N
- Electronic Component
- MOSFET
- Electronic Component
- 0.14g
- Electronic Component
- 1
- Electronic Component
- BM0227639137
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 15.1W
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
- Voltage(Vdss)
- 60V
- Capacitor(Ciss)
- 2.1nF
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
WSD6040DN56 产品概述
一、产品简介
WSD6040DN56 是 WINSOK（微硕）推出的一颗 N 沟道功率 MOSFET，额定漏源电压 60V，适合中小功率开关与功率管理场景。器件采用 DFN-8-EP（6.1 × 5.2 mm）小体积露铜底板封装，工作温度范围宽 (-55℃ ～ +150℃)，在紧凑 PCB 布局下兼顾导通损耗与热性能。
二、主要参数
- 漏源电压 Vdss：60V
- 连续漏极电流 Id：36A
- 导通电阻 RDS(on)：14 mΩ @ Vgs=10V, Id=25A
- 栅极阈值电压 Vgs(th)：1.6V
- 总栅极电荷 Qg：42 nC @ Vgs=10V
- 输入电容 Ciss：2.1 nF @ 30V
- 反向传输电容 Crss：100 pF @ 30V
- 最大耗散功率 Pd：15.1W
- 工作温度：-55℃ ～ +150℃
- 封装：DFN-8-EP (6.1 × 5.2 mm)
- 品牌：WINSOK（微硕）
三、主要特点与设计要点
- 低 RDS(on)：14 mΩ（10V 门电压）在高电流场景下可显著降低导通损耗，适用于高效率转换器与功率开关。举例：若连续电流为 25A，导通损耗约为 25^2 × 0.014 ≈ 8.75W，需做好散热设计。
- 中等栅电荷：Qg=42nC，属于中等量级。若要求快速翻转（如 50 ns），栅极瞬时电流约为 Qg / dt ≈ 0.84 A，需选用能提供较大峰值电流的驱动器；而在 100 kHz 开关频率下平均栅驱电流仅约 4.2 mA，栅驱功率约 42 mW（10V 驱动）。
- 封装与散热：DFN-8-EP 带大露铜底板，便于通过多层铜箔及过孔将热量引导到散热层。合理的焊盘、加热焊接和铜厚度对降低结温至关重要。
- 宽温工作：器件可在高温环境下工作，适合工业级应用，但在极限功耗条件下需注意 SOA 与热失控。
四、典型应用
- 同步整流与降压（Buck）转换器功率开关
- 负载开关与功率路径控制
- 电机驱动前端及功率级
- 电池管理与便携设备电源管理
- 工业电源与通信供电模块
五、选型与使用建议
- 推荐以 10V 门驱获得标称 RDS(on)；若使用 4.5V 或更低门压，应验证实际导通损耗。
- 设计时按实际工作电流估算导通损耗与开关损耗，并以 Pd 与 PCB 散热能力为准配置铜厚、铜面积与过孔。
- 若追求较快开关边沿，需配合能够提供 1A 级峰值驱动电流的栅极驱动器，并在门极串联小电阻（数 Ω）以抑制振铃与 EMI。
- 请参阅完整数据手册以确认最大 Vgs、瞬态极限和封装具体焊盘尺寸，完成可靠性评估。
如需基于具体工作点（电流、频率、PCB 板型）进行损耗计算或散热布局建议，我可以帮您做更精确的热流和驱动选型分析。
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